BINGHAMTON, NY – The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) at Binghamton University and the Southern Tier Opportunity Coalition (STOC) honored five individuals Wednesday for their efforts in promoting economic development in the Southern Tier.

William Murphy, retired senior engineer and fellow at Lockheed Martin, was recognized as Technology Innovation Leader of the Year for his efforts in shaping the technology community through leadership in electronics packaging.

Saurabh Shrivastava, senior lead thermal mechanical engineer at Panduit Corp., was recognized as Technology Innovation Mentor/Educator of the Year for his significant impact on the Watson School, Binghamton University and the technology community at large.

Eugene Krentsel, assistant vice president, Entrepreneurship and Innovation Partnerships at Binghamton University, was recognized as Technology Innovation Entrepreneur of the Year for his contributions to the growth of dynamic, high technology business in upstate New York.

William Berical, retired vice president for platform solutions at BAE Systems, and Charles Becker, chief scientist, Electrical Technologies and Systems, General Electric, received the STOC/S3IP Lifetime Achievement in Technology Innovation Award.

The awards were announced at the S3IP Annual Dinner on November 7. The dinner featured remarks by Bahgat Sammakia, vice president for research at Binghamton University and S3IP director. David Gdovin, vice president of STOC, joined him in presenting the technology innovation awards. 

For more information, call Mary Beth Curtin, S3IP associate director at 607-777-7270.