Professor SB Park from the Mechanical Engineering Department will receive the Excellence in Mechanics Award Aug. 30, 2018, from the American Society of Mechanical Engineers' Electronics and Photonic Packaging Division.
The award is in recognition of outstanding achievement in engineering and is only given once to an individual who has demonstrated excellence in the engineering and science of structural mechanics of electronic systems.
However, if you ask Park, he will humbly say, "I did not do much other than performing as usual."
Park is the director of the Integrated Electronics Engineering Center (IEEC) and the Optomechanics and Physical Reliability Laboratory at Binghamton University.
He started his academic career at Binghamton University in 2002, and his expertise in micro/nano mechanics and optomechanics contributes to the center in conducting on-going and prospective projects.
Park first began his professional career at IBM Microelectronics Division where he conducted numerous analyses to put products out on time. Later he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high-performance packaging.
The award will be given at the 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in San Francisco.