SB Park Receives Clock Award at ASME Conference
Director SB Park of the IEEC was presented with the 2019 Clock Award at ASME's 2019
InterPACK Conference (International Technical Conference and Exhibition on Packaging
and Integration of Electronic and Photonic Microsystems) that took place October 7-9
in Anaheim, CA.
This award was presented by the K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division for Park's outstanding accomplishments and service to the field of Electronics and Photonics Packaging.
Benson Chan Receives iMAPS Award for Outstanding Educator
Associate Director, Benson Chan, of the IEEC, was presented the award for Outstanding Educator at iMAPs 52nd International Symposium on Microelectronics that took place September 30-October 3, 2019, in Boston, MA.
A visit from Tioga Hills Elementary School
Yet again, another fun-filled day with our young friends from Tioga Hills Elementary School. On Monday, April 29, Research Scientists Dr. Jung, Dr. Sharma, and Dr. Proper, from the Analytical and Diagnostic Laboratory (ADL), met with fourth-graders to give a tour of the lab. The students were able to learn about scientist works and the kinds of equipment used, along with experimenting with liquid nitrogen in a safe yet fun environment.
A visit from Vestal Hills Elementary School
On Friday, March 29, the Analytical and Diagnostic Laboratory (ADL), a fellow member of our family of research centers, provided a lab tour for our special visitors from Vestal Hills Elementary School.
The tour provided an opportunity for fourth grade students to see firsthand the works of a scientist and the equipment they use.
Scientist Jenny Proper, showed what it would be like to see specimens and pollen samples in high resolution under an electron microscope, while Senior Scientist Anju Sharma, engaged the students in interactive experiments with liquid nitrogen, by freezing flowers and cheese puffs, to highlight its properties and portray the effects, in a fun manner.
The lab tour allowed for students to walk away with an educational experience beyond the classroom, taking away with them the values and possibilities offered in the field of science.
IEEC to receive Outstanding Research Award, presented by Koh Young Technology, Inc.
Working together for nearly 3 years in SEML, Koh Young Technology Inc. has been a part of providing invaluable technical support with the smart factory, and together, our research has advanced in fine-tuning SMT to feature accuracy, reliability and process optimization.
Thank you Koh Young Technology Inc., for this recognition and your valued partnership.
2019 Binghamton University Industry Day
We would like to place a special thanks to ASE for graciously hosting our successful "Binghamton University Industry Day."
This event took place in San Jose, California, where our IEEC Director, SB Park and Associate director, Benson Chan, together with the S3IP team, provided companies on the west coast an opportunity to learn about the uniqueness of our centers and labs.
Topics of interest were:
• Thermal management, failure analysis, reliability improvement, material properties and mechanics for electronics manufacturing, including heterogeneous integration
• Advances in Industry 4.0 automation for electronics manufacturing lines
• Progress in commercialization of flexible hybrid electronics
• Techniques for data center energy efficiency improvement
• Warpage Engineering and stress reduction for improved assembly and reliability
More information on this event to come.
Technical Advisory Board Meeting Held at the COE
Thank you to our Technical Advisory Board, faculty and staff members for attending our Technical Advisory Board Meeting held on March 12, 2019.
At this meeting, industry members shared their project needs, while faculty members shared their research topics. This opened the floor for potential collaboration on Pooled Research Projects for the year 2019-2020.
Faculty members are encouraged to submit proposals for an opportunity to be "seed" funded by the IEEC.
Deadline for submission of research proposals: April 30, 2019
Awarding of the 2019-2020 Pooled Research Projects: May 15, 2019
Please take a look at our guidelines.
Proposals may be submitted to IEEC@binghamton.edu.
You may also contact the above address with questions or requests for more information regarding our TAB member presentations.
SB Park To Receive Excellence in Mechanics Award
On August 30, 2018, Professor SB Park from the Mechanical Engineering Department, is to receive the Excellence in Mechanics Award, presented by the American Society of Mechanical Engineers' Electronics and Photonic Packaging Division.
This award is in recognition of outstanding achievement in engineering, presented only once to an individual who has demonstrated excellence in the engineering and science of structural mechanics of electronic systems. However, if you ask Park, he will humbly say, "I did not do much other than performing as usual."
Park is the director of the Integrated Electronics Engineering Center (IEEC) and the Optomechanics and Physical Reliability Laboratory at Binghamton University.
He began his academic career at Binghamton University in 2002, and his expertise in micro/nano mechanics and optomechanics contributes to the center in conducting on-going and prospective projects.
Park first began his professional career at IBM Microelectronics Division where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high-performance packaging.
Park will receive this award at the 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in San Francisco.
IEEC held its Technical Advisory Board (TAB) at Binghamton University's Center of Excellence.
The Integrated Electronics Engineering Center (IEEC) held its Technical Advisory Board (TAB) Meeting on June 12, 2018 at Binghamton University's Center of Excellence. Associate Director, Benson Chan, announced the 2018-2019 Pooled Research Projects.
This year, six projects will receive a funding of $50,000 and and additional three projects will receive a "seed" funding of $25,000. A total of nineteen projects were submitted.
The 2018-2019 projects are as below:
- Beyond Silicone Elastomer - Ahyeon Koh
- Computational Study on the Mechanical Properties of Bi alloys for Pb-free Solder - Manuel Smeu
- Micron-level Thermal and Mechanical Characterization of Thermal Interface Materials to Understand Material Variability to Prevent Hot-Spot - Scott Schiffres
- Properties and Use of Fused Nano-Particles – Peter Borgesen
- Smart Chip Mounting Process Control in PCB Assembly Process via Artificial Intelligence - Daehan Won and Sang Won Yoon
- Toward Green and Biodegradable Electronics: Paper-based Printed Circuit Boards - Seokheun Choi
- The Behavior of PbFree Solder Joints Containing Bi: High Melt -Low Melt Solder Interconnect Structures for SMT Applications - Eric Cotts and Nikolay Dimitrov
- DasPritramThree Phase High Power Density Wide Band Gap (WBG) Devices and Commercial off the Shelf (COTS) Components Based AC to DC Power Converters for More Electric Aircraft System -
- Tomographic Characterization of Waveguides Fabricated by Laser Direct Writing – Bonggu Shim
For additional information, or to partner with us, please contact Benson Chan (email@example.com)
Binghamton University Day at ASE
SB Park, Director of the IEEC, and Benson Chan, Associate Director, traveled with the S3IP Team to San Jose, CA to meet with over 20 companies during S3IP Industry Day, June 18-19. Presentation topics included:
- Thermal management, failure analysis, reliability improvement, material properties and mechanics for electronics manufacturing, including heterogeneous integration
- Advances in Industry 4.0 automation for electronics manufacturing lines
- Progress in the commercialization of flexible hybrid electronics
Contact us for more information.
Debbie Dittrich shares her experience working at IEEC
Debbie Dittrich is a Research Support Specialist who has been a staff member at the IEEC for fifteen years. Dittrich specializes in teardown analysis of electronics for various companies, failure analysis of circuit package manufacturing problems, and provides cross-sections, digital images and measurements of components in the products she receives.
Her skills and line of work are an impressive list which extends to work related with x-ray and SEM.
Prior to joining the IEEC, Dittrich was a member of the IBM Endicott Microelectronics Division and IBM Owego Circuit Packaging Division for seventeen years. Her most recent work has been evaluating the iPhone X and the Samsung Galaxy S9 (courtesy of Prismark Partners) using x-ray imaging and cross-sectioning techniques.
The measurements she takes can vary depending on the product and the elements of interest in the electronic device. Once the sample has been grounded to the appropriate plane, it must be highly polished to ensure the clearest surface for measurements. A Nikon camera is used to take images of the cross-section which are then analyzed for measurements. This requires a high degree of attention to detail. Debbie has also done work with watches, other Apple products, and speakers from phones.
Please contact Debbie at firstname.lastname@example.org if you would like to know more about her work.
IEEC presented 9 research papers at ECTC in San Diego, California
The Integrated Electronics Engineering Center (IEEC) took part at ECTC in San Diego, California, on May 28. The IEEC introduced nine papers/presentations at ECTC, which included:
- Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, and Seungbae Park – Binghamton University; Hohyung Lee, Gamal Refai-Ahmed, Laurene Yip – Xilinx, Inc.
- Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management Jisun Hong and Kyongsei Cho – Samsung Electronics Company, Ltd.; Seungbae Park, Shuai Shao, Yuling Niu, Huayan Wang, and Van Lai Pham – Binghamton University
- Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding Junghyun Cho and Fei Dong – Binghamton University; Liang Yin and David Shaddock – GE Global Research
- Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability Luke Wentlent – Universal Instruments Corp.; Mohammed Genanu, Thaer Alghoul, and Peter Borgesen – Binghamton University; Jim Wilcox – Universal Instruments Corp; Francis Mutuku – Indium Corporation
- Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method Van Lai Pham, Yuling Niu, Jing Wang, Huayang Wang, Shuai Shao, Charandeep Singh and Seungbae Park – Binghamton University; Cheng Zhong, Sau Wee Koh and Jifan Wang – Huawei Technology Co., Ltd.
- Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor Thaer Alghoul, Manu Yadav, Sanoop Thekkut, Rajesh Sivasubramony, Christopher Greene, Mark Poliks, and Peter Borgesen – Binghamton University; Luke Wentlent and Michael Meilunas – Universal Instruments; Nancy Stoffel, David Shaddock and Liang Yin – GE Global Research
- Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications B. Lee, R. Katkar, G. Gao, G. Fountain, S. Lee, L. Wang, C. Mandalapu, C. Uzoh and L. Mirkarimi – Xperi; B. Sykes and M. Litjens – Xyztec; Y. Niu, S. Shao, J. Wang and S. Park – Binghamton University
- Modeling and Design of 2.5D Package With Mitigated Warpage and Enhanced Thermo-Mechanical Reliability Jing Wang, Yuling Niu, and Seungbae Park – Binghamton University; Alexander Yatskov – Juniper Networks
- The Experimental and Numerical Study of Electromigration in 2.5D Packages Jiefeng Xu, Yuling Niu, Stephen R. Cain, and S.B. Park – Binghamton University; Scott McCann, Hohyung Lee, and Gamal Refai-Ahmed – Xilinx, Inc
In addition to the papers, IEEC Director, SB Park served as Session Chair for the Applied Reliability session, and IEEC Associate Director, Benson Chan served as Session Chair for the Emerging Technologies Joint with Advanced Packaging session.