SB Park Receives Clock Award at ASME Conference

Director SB Park of the IEEC was presented with the 2019 Clock Award at ASME's 2019 InterPACK Conference (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) that took place October 7-9 in Anaheim, CA.
This award was presented by the K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division for Park's outstanding accomplishments and service to the field of Electronics and Photonics Packaging.

Benson Chan Receives iMAPS Award for Outstanding Educator 

Associate Director, Benson Chan, of the IEEC, was presented the award for Outstanding Educator at iMAPs 52nd International Symposium on Microelectronics that took place September 30-October 3, 2019, in Boston, MA.

SB Park To Receive Excellence in Mechanics Award

On August 30, 2018, Professor SB Park from the Mechanical Engineering Department, is to receive the Excellence in Mechanics Award, presented by the American Society of Mechanical Engineers' Electronics and Photonic Packaging Division.

This award is in recognition of outstanding achievement in engineering, presented only once to an individual who has demonstrated excellence in the engineering and science of structural mechanics of electronic systems. However, if you ask Park, he will humbly say, "I did not do much other than performing as usual."

Park is the director of the Integrated Electronics Engineering Center (IEEC) and the Optomechanics and Physical Reliability Laboratory at Binghamton University.

He began his academic career at Binghamton University in 2002, and his expertise in micro/nano mechanics and optomechanics contributes to the center in conducting on-going and prospective projects.

Park first began his professional career at IBM Microelectronics Division where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high-performance packaging.

Park will receive this award at the 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in San Francisco.

IEEC held its Technical Advisory Board (TAB) at Binghamton University's Center of Excellence.

The Integrated Electronics Engineering Center (IEEC) held its Technical Advisory Board (TAB) Meeting on June 12, 2018 at Binghamton University's Center of Excellence. Associate Director, Benson Chan, announced the 2018-2019 Pooled Research Projects.

This year, six projects will receive a funding of $50,000 and and additional three projects will receive a "seed" funding of $25,000. A total of nineteen projects were submitted.

The 2018-2019 projects are as below:

  • Beyond Silicone Elastomer - Ahyeon Koh
  • Computational Study on the Mechanical Properties of Bi alloys for Pb-free Solder - Manuel Smeu
  • Micron-level Thermal and Mechanical Characterization of Thermal Interface Materials to Understand Material Variability to Prevent Hot-Spot - Scott Schiffres
  • Properties and Use of Fused Nano-Particles – Peter Borgesen
  • Smart Chip Mounting Process Control in PCB Assembly Process via Artificial Intelligence - Daehan Won and Sang Won Yoon
  • Toward Green and Biodegradable Electronics: Paper-based Printed Circuit Boards - Seokheun Choi
  • The Behavior of PbFree Solder Joints Containing Bi: High Melt -Low Melt Solder Interconnect Structures for SMT Applications - Eric Cotts and Nikolay Dimitrov
  • DasPritramThree Phase High Power Density Wide Band Gap (WBG) Devices and Commercial off the Shelf (COTS) Components Based AC to DC Power Converters for More Electric Aircraft System -
  • Tomographic Characterization of Waveguides Fabricated by Laser Direct Writing – Bonggu Shim

For additional information, or to partner with us, please contact Benson Chan (

Binghamton University Day at ASE

SB Park, Director of the IEEC, and Benson Chan, Associate Director, traveled with the S3IP Team to San Jose, CA to meet with over 20 companies during S3IP Industry Day, June 18-19. Presentation topics included:

  • Thermal management, failure analysis, reliability improvement, material properties and mechanics for electronics manufacturing, including heterogeneous integration
  • Advances in Industry 4.0 automation for electronics manufacturing lines
  • Progress in the commercialization of flexible hybrid electronics

Contact us for more information.

Debbie Dittrich shares her experience working at IEEC

Debbie Dittrich is a Research Support Specialist who has been a staff member at the IEEC for fifteen years. Dittrich specializes in teardown analysis of electronics for various companies, failure analysis of circuit package manufacturing problems, and provides cross-sections, digital images and measurements of components in the products she receives.

Her skills and line of work are an impressive list which extends to work related with x-ray and SEM.

Prior to joining the IEEC, Dittrich was a member of the IBM Endicott Microelectronics Division and IBM Owego Circuit Packaging Division for seventeen years. Her most recent work has been evaluating the iPhone X and the Samsung Galaxy S9 (courtesy of Prismark Partners) using x-ray imaging and cross-sectioning techniques.

The measurements she takes can vary depending on the product and the elements of interest in the electronic device. Once the sample has been grounded to the appropriate plane, it must be highly polished to ensure the clearest surface for measurements. A Nikon camera is used to take images of the cross-section which are then analyzed for measurements. This requires a high degree of attention to detail. Debbie has also done work with watches, other Apple products, and speakers from phones.

Please contact Debbie at if you would like to know more about her work.

IEEC presented 9 research papers at ECTC in San Diego, California

The Integrated Electronics Engineering Center (IEEC) took part at ECTC in San Diego, California, on May 28. The IEEC introduced nine papers/presentations at ECTC, which included:

  • Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, and Seungbae Park – Binghamton University; Hohyung Lee, Gamal Refai-Ahmed, Laurene Yip – Xilinx, Inc.
  • Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management Jisun Hong and Kyongsei Cho – Samsung Electronics Company, Ltd.; Seungbae Park, Shuai Shao, Yuling Niu, Huayan Wang, and Van Lai Pham – Binghamton University
  • Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid Phase (TLP) Bonding Junghyun Cho and Fei Dong – Binghamton University; Liang Yin and David Shaddock – GE Global Research
  • Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability Luke Wentlent – Universal Instruments Corp.; Mohammed Genanu, Thaer Alghoul, and Peter Borgesen – Binghamton University; Jim Wilcox – Universal Instruments Corp; Francis Mutuku – Indium Corporation
  • Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method Van Lai Pham, Yuling Niu, Jing Wang, Huayang Wang, Shuai Shao, Charandeep Singh and Seungbae Park – Binghamton University; Cheng Zhong, Sau Wee Koh and Jifan Wang – Huawei Technology Co., Ltd.
  • Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor Thaer Alghoul, Manu Yadav, Sanoop Thekkut, Rajesh Sivasubramony, Christopher Greene, Mark Poliks, and Peter Borgesen – Binghamton University; Luke Wentlent and Michael Meilunas – Universal Instruments; Nancy Stoffel, David Shaddock and Liang Yin – GE Global Research
  • Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications B. Lee, R. Katkar, G. Gao, G. Fountain, S. Lee, L. Wang, C. Mandalapu, C. Uzoh and L. Mirkarimi – Xperi; B. Sykes and M. Litjens – Xyztec; Y. Niu, S. Shao, J. Wang and S. Park – Binghamton University
  • Modeling and Design of 2.5D Package With Mitigated Warpage and Enhanced Thermo-Mechanical Reliability Jing Wang, Yuling Niu, and Seungbae Park – Binghamton University; Alexander Yatskov – Juniper Networks
  • The Experimental and Numerical Study of Electromigration in 2.5D Packages Jiefeng Xu, Yuling Niu, Stephen R. Cain, and S.B. Park – Binghamton University; Scott McCann, Hohyung Lee, and Gamal Refai-Ahmed – Xilinx, Inc

In addition to the papers, IEEC Director, SB Park served as Session Chair for the Applied Reliability session, and IEEC Associate Director, Benson Chan served as Session Chair for the Emerging Technologies Joint with Advanced Packaging session.

For more information about our research and center, please contact Benson Chan or SB Park