35th Annual Electronics Packaging Symposium

A message from the 2024 EPS Organizing Committee:

Our 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at the Binghamton University Innovative Technologies Complex. We will focus on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We will update this webpage with the session titles and keynote speakers. We look forward to seeing you in September.

Click here to download the 2023 program.

  Program Header




Dr. Mukesh V. Khare

Vice President, Semiconductor and AI Hardware

IBM Research


Dr. Bahgat Sammakia

Vice President for Research

Binghamton University

ge research

Cliff Macklin

Technology Director, Digital & Electrical Systems

GE Research