35th Annual Electronics Packaging Symposium

A message from the 2024 EPS Organizing Committee:

Our 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at the Binghamton University Innovative Technologies Complex. We will focus on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We will update this webpage with the session titles and keynote speakers. We look forward to seeing you in September.

Click here to download the 2023 program.


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Sponsors

EXECUTIVE CHAIRS:

khare

Dr. Mukesh V. Khare

Vice President, Semiconductor and AI Hardware

IBM Research

sammakia

Dr. Bahgat Sammakia

Vice President for Research

Binghamton University

ge research

Cliff Macklin

Technology Director, Digital & Electrical Systems

GE Research