A Message from the 2026 EPS Organizing Committee:
Our 37th annual Electronics Packaging Symposium will take place on Sept. 9-10, 2026, at the ITC Campus at Binghamton University. We will focus on various aspects of electronic packaging and how advanced packaging is evolving toward a Chiplet future. We look forward to seeing you there.
Registration link: TBD
EXECUTIVE CHAIRS:
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Dr. Mukesh V. Khare Vice President, Semiconductor and AI Hardware IBM Research |
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Dr. Bahgat Sammakia Vice President for Research Binghamton University |
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Cliff Macklin Technology Director, Digital & Electrical Systems GE Research |