ADVANCING FORWARD, TOGETHER.

It is the curiosity, work ethics, and values behind people that drive innovation. An interrelated network of people with skill and the sharing of valuable knowledge is required to efficiently solve the complexities found in the field of electronics packaging.

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 The IEEC is uniquely positioned to house all of the above, and promotes the growth and development in people, the field, the industry, and the community.

We aim to:

CONNECT industry needs with opportunity for faculty and students through collaborative research projects.

IDENTIFY PROBLEMS and provide technical solutions to our clients.

TRAIN students and clients on cutting-edge equipment to add value to projects.

EDUCATE students through research.

RESEARCH to simplify and solve the challenges in electronics packaging, integrate AI, and advance towards Industry 4.0.

  

 FEATURING:

    

      

LATEST IEEC NEWS

ECTC Committee Meet in Dallas to Review Abstracts for 2020 Conference

Image: Associate Director of IEEC and Chair of ECTC Emerging Technologies Session, Benson Chan (most left), with his committee members.
Associate Director of IEEC and Chair of ECTC Emerging Technologies Session, Benson Chan (most left), with his committee members.

The Electronic Components and Technology Conference (ECTC) Program Committee, made up of professors and instructors for academia and industry, convened in Dallas, Texas on November 7-8, 2019 to review well over 500 abstracts for the 2020 conference taking place on May 26-29, 2020 at Walt Disney World Swan and Dolphin Resort in Lake Buena Vista, Florida.

IEEC Director, SB Park, and Associate Director, Benson Chan, made their way to Dallas to participate in the two-day review process as they are active members of the ECTC Committee:  Park is Chair of the Applied Reliabilty Committee, while Chan is Chair of the Emerging Technologies Committee.  

Director Mark Poliks of our sister center, Center for Advanced Microelectronics Manufacturing (CAMM), is also an actively involved member who previously served as Vice General Chair of the ECTC Executive Committee.

These papers will be presented by members from companies, universities and research institutions, covering a wide range of topics which include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.

For more information, visit www.ectc.net.


     

SB Park Receives Clock Award at ASME Conference

Image: SB Park receiving the Clock Award at the 2019 ASME InterPACK Conference
SB Park receiving the Clock Award at the 2019 ASME InterPACK Conference

Director SB Park of the IEEC was presented with the 2019 Clock Award at ASME's 2019 InterPACK Conference (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) that took place October 7-9 in Anaheim, CA.
This award was presented by the K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division for Park's outstanding accomplishments and service to the field of Electronics and Photonics Packaging.

Congratulations Director Park for your dedication and service to the field.      


 Benson Chan Receives iMAPS Outstanding Educator Award

Image: Benson Chan is recognized as an outstanding educator at the 2019  iMAPS conference
Benson Chan is recognized as an outstanding educator at the 2019 iMAPS conference

Associate Director, Benson Chan, of the IEEC, was presented with the Outstanding Educator Award at iMAPs 52nd International Symposium on Microelectronics, which took place September 30-October 3, 2019, in Boston, MA.

This award is presented to an individual who has provided significant contributions to education, within or outside the realms of academia, for the electronics packaging industry and/or to the advancement of IMAPS Student Chapters. 

Image: Chan giving a lecture for an engineering course at BU
Chan giving a lecture for an engineering course at BU

iMaps is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

Benson Chan is the president of the Empire Chapter of iMAPS and is active in organizing local workshops and meetings to connect members in upstate NY with topics pertinent to the evolving field.

Congratulations to Benson Chan for his active role and continued dedication in sharing knowledge with a community of students, faculty and members of organizations and industry.


2019 Electronics Packaging Symposium Poster Session Winners Recognized for their Excellence in Research

Image: Professor Manuel Smeu (faculty advisor for first place), Michael Woodcox (first place winner) Dean Krishnaswami "Hari" Srihari (Dean of Thomas J. Watson School of Engineering and Applied Science), Professor S.B. Park (faculty advisor for second place), VanLai Pham (second place research team member), Mohammed Alhendi (third place research team member) and Professor Peter Borgesen (faculty advisor for third place).
Professor Manuel Smeu (faculty advisor for first place), Michael Woodcox (first place winner) Dean Krishnaswami "Hari" Srihari (Dean of Thomas J. Watson School of Engineering and Applied Science), Professor S.B. Park (faculty advisor for second place), VanLai Pham (second place research team member), Mohammed Alhendi (third place research team member) and Professor Peter Borgesen (faculty advisor for third place).

Congratulations to the student poster session winners who presented at the 31st Annual Electronics Packaging Symposium at Niskayuna, NY. 37 Students participated in the poster session and were able to meet and share their research with attendees from across disciplines in industry, academia and government.

First Place: Michael Woodcox and his research team

Second Place: Jiefeng Xu and his research team 

Third Place: Arun Raj and his research team.

 You may find out more about the winners in this article released in the Binghamton University News website.


 Student and Faculty Recognized for Excellence in Research in the SEMLab
Image:  From left to right: Hongya Lu, Prof. Sang Won Yoon, Irandokht Parviziomran, Prof. Daehan Won, Jae Lee, Director S.B. Park, Jong Ha, Ke Pan, Associate Director Benson Chan, Nourma Khader.
From left to right: Hongya Lu, Prof. Sang Won Yoon, Irandokht Parviziomran, Prof. Daehan Won, Jae Lee, Director S.B. Park, Jong Ha, Ke Pan, Associate Director Benson Chan, Nourma Khader.

In celebration of the achievements made in our SEMLab, in partnership with Koh Young Techonology, a luncheon and a time of recognition took place on July 30.  Seven faculty members and graduate students were recognized for their research contributions to the development of the lab. 

A special congratulations to the four student recepients of the IEEC Award for Excellence in Research: Hongya Lu, Irandokht Parviziomran, Jong Ha, and Ke Pan!