Asymtek Automove 400 Under Fill Dispenser
The Asymtek Automove 400 under fill dispenser is a high speed, computer controlled fluid dispensing system. The primary function for circuit boards is to dispense solder masks, solder pastes and SMT adhesives. It is adaptable to a variety of substrates for dispensing other fluids such as epoxies, potting compounds and RTV silicone. The unit has an X, Y, Z positioning system.
Location
Smart Electronics Manufacturing Lab, Center of Excellence
Camalot 1818 Dispensing System
The Camalot 1818 Dispensing System is an SMT mount assembly and semiconductor that has packaging applications to include solder pastes/solder masks, conductive adhesives, gasketing dam and fill, and glob-top encapsulation and flip chip under fill. The unit features a maximum dispense area of 457 mm x 457 mm; resolution of 0.0127 mm; max x/y axis speed 254 mm/sec; dispensing rate 16,000 dots/hour @ 0.020" centers and 13,000 dots/hour @ 0.125 centers. Dispensing methods include rotary auger, multi-piston pump and/or time/pressure
Location
Smart Electronics Manufacturing Lab, Center of Excellence
ESEC 3018 Wire Bonder
The ESEC 3018 Wire Bonder is a fine pitch, automated ball bonder with 25 um wire. The unit can accommodate lead frames up to 90 mm; support multiple chip and multiple lead frame configurations; and bond parameters individually programmable by bond site. The bonder has a vision system monitor for set up and viewing bonding.
Location
Reliability Lab, Biotechnology Building
Heller 1700W Convection Reflow Oven
The Heller 1700W Convention Reflow Oven is a forced convection oven that uses air or inert atmosphere. This unit features 95% efficient flux filtration; single or dual-rail edge conveyor; independently adjustable rail speeds; dual temperature profile capability; and supports both reflow and snap curing. The oven has broad widths of 23.6" (single-rail edge) and 10" (dual-rail edge). The temperature control response is <1sec/0.1 C change; gradient <2 C throughout the oven.
Location
Smart Electronics Manufacturing Lab, Center of Excellence
RDA M-8AN Flip Chip Aligner Bonder
(this is a duplication information for the record above)
The Heller 1700W Convention Reflow Oven is a forced convection oven that uses air or inert atmosphere. This unit features 95% efficient flux filtration; single or dual-rail edge conveyor; independently adjustable rail speeds; dual temperature profile capability; and supports both reflow and snap curing. The oven has broad widths of 23.6" (single-rail edge) and 10" (dual-rail edge). The temperature control response is <1sec/0.1 C change; gradient <2 C throughout the oven.
For more information or to arrange for use of the equipment listed below, please contact:
Steve Cain - 607-777-5467 or scain@binghamton.edu
Ron Kuracina - 607-777-4334 or kuracina@binghamton.edu