ADVANCING FORWARD, TOGETHER.
It is the curiosity, work ethics, and values behind people that drive innovation. An interrelated network of people with skill and the sharing of valuable knowledge is required to efficiently solve the complexities found in the field of electronics packaging.
The IEEC is uniquely positioned to house all of the above, and promotes the growth and development in people, the field, the industry, and the community.
We aim to:
CONNECT industry needs with opportunity for faculty and students through collaborative research projects.
IDENTIFY PROBLEMS and provide technical solutions to our clients.
TRAIN students and clients on cutting-edge equipment to add value to projects.
EDUCATE students through research.
RESEARCH to simplify and solve the challenges in electronics packaging, integrate AI, and advance towards Industry 4.0.
Our research facilities will be open for qualified projects that have been approved by Binghamton University. Please contact us to discuss your needs and to understand our process as we resume in line with standards set by New York state and the Centers for Disease Control and Prevention.
Our Return to Research subcommittee, in consultation with Environmental Health and Safety experts and the Public Health Advisory Group, created a set of protocols and expectations that will govern our return to research.
Please keep in mind that the center is still following the directives to work from home when possible. The IEEC will continue to provide email support and is open for consultations via communication tools such as Zoom during our regularly scheduled hours (8:00am -5:00pm).
You can reach us at firstname.lastname@example.org, and we will put you in contact with the appropriate staff member(s) to answer your questions/setup an appointment.
New York State
LATEST IEEC NEWS
2020 - 2021 Cycle Pooled Project Proposals
Our Spring TAB Meeting was held on Wednesday February 26. At this meeting, our industry members presented their project needs for this year's cycle of pooled projects.
We invite BU faculty members to submit a proposal and also encourage reaching out to our TAB members to assist you in the development of your proposal.
Extended Proposal Deadline: May 4, 2020 (by 5 PM to email@example.com)
For access to proposal guidelines and industry presentations, contact firstname.lastname@example.org
Lunch and Learn
We would like to invite all BU faculty from the Department of Physics, Chemistry, and Watson to join us for our "Lunch and Learn" meeting on Monday, February 24, from 11:30am-1:30pm in the Multipurpose Room (COE 2011) at the Center of Excellence.
Join us to learn about our center and the opportunities we can assist you with.
BU Day at the Oakdale Mall
On February 22, 2020, Binghamton University hosted it's Annual Day at the Oakdale Mall in Johnson City. The IEEC and students from the Mechanical Engineering Department demonstrated the use of a 3D Printer and the possibilities of what could be created with such equipment. Parents and children who stopped by were able to take home fun 3D printed trinkets.
This event opens the door for the community to have a glimpse of the kinds of research and programs taking place at BU, as well as inspire children through exposure to different disciplines that they could potentially pursue in the future.
ECTC Committee Meet in Dallas to Review Abstracts for 2020 Conference
The Electronic Components and Technology Conference (ECTC) Program Committee, made up of professors and instructors for academia and industry, convened in Dallas, Texas on November 7-8, 2019 to review well over 500 abstracts for the 2020 conference taking place on May 26-29, 2020 at Walt Disney World Swan and Dolphin Resort in Lake Buena Vista, Florida.
IEEC Director, SB Park, and Associate Director, Benson Chan, made their way to Dallas to participate in the two-day review process as they are active members of the ECTC Committee: Park is Chair of the Applied Reliabilty Committee, while Chan is Chair of the Emerging Technologies Committee.
Director Mark Poliks of our sister center, Center for Advanced Microelectronics Manufacturing (CAMM), is also an actively involved member who previously served as Vice General Chair of the ECTC Executive Committee.
These papers will be presented by members from companies, universities and research institutions, covering a wide range of topics which include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.
For more information, visit www.ectc.net.
SB Park Receives Clock Award at ASME Conference
Director SB Park of the IEEC was presented with the 2019 Clock Award at ASME's 2019
InterPACK Conference (International Technical Conference and Exhibition on Packaging
and Integration of Electronic and Photonic Microsystems) that took place October 7-9
in Anaheim, CA.
This award was presented by the K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division for Park's outstanding accomplishments and service to the field of Electronics and Photonics Packaging.
Congratulations Director Park for your dedication and service to the field.
Benson Chan Receives iMAPS Outstanding Educator Award
Associate Director, Benson Chan, of the IEEC, was presented with the Outstanding Educator Award at iMAPs 52nd International Symposium on Microelectronics, which took place September 30-October 3, 2019, in Boston, MA.
This award is presented to an individual who has provided significant contributions to education, within or outside the realms of academia, for the electronics packaging industry and/or to the advancement of IMAPS Student Chapters.
iMaps is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Benson Chan is the president of the Empire Chapter of iMAPS and is active in organizing local workshops and meetings to connect members in upstate NY with topics pertinent to the evolving field.
Congratulations to Benson Chan for his active role and continued dedication in sharing knowledge with a community of students, faculty and members of organizations and industry.
2019 Electronics Packaging Symposium Poster Session Winners Recognized for their Excellence in Research
Congratulations to the student poster session winners who presented at the 31st Annual Electronics Packaging Symposium at Niskayuna, NY. 37 Students participated in the poster session and were able to meet and share their research with attendees from across disciplines in industry, academia and government.
First Place: Michael Woodcox and his research team
Second Place: Jiefeng Xu and his research team
Third Place: Arun Raj and his research team.
You may find out more about the winners in this article released in the Binghamton University News website.
Student and Faculty Recognized for Excellence in Research in the SEMLab
In celebration of the achievements made in our SEMLab, in partnership with Koh Young Techonology, a luncheon and a time of recognition took place on July 30. Seven faculty members and graduate students were recognized for their research contributions to the development of the lab.
A special congratulations to the four student recepients of the IEEC Award for Excellence in Research: Hongya Lu, Irandokht Parviziomran, Jong Ha, and Ke Pan!