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Contact the IEEC:
Daryl Santos
Director IEEC
santos@binghamton.edu
Phone: 607-777-4769
Fax: 607-777-4683

i3  GE

BAE

Corning

Analog

SPIL

ASE  IBM

AMD

Universal

Samsung

Lockheed Martin

The Integrated Electronics Engineering Center (IEEC) is a New York State Center for Advanced Technology in Electronics Packaging. Formed in 1991, the IEEC is dedicated to the advancement of electronic packaging technology and the electronics industry. We conduct leading edge research in a wide variety of packaging areas for the technological and economic benefit of our member companies. The combined expertise and facilities of the IEEC and associated Engineering and Science departments at Binghamton University are available to affiliated companies to help advance their business.

 

Click HERE to register for the 2015 Electronics Packaging Symposium!

 

 Gold Sponsorship provided by:

Lockheed
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 8/3/15