Park started his academic career at Binghamton University in 2002. He has been involved in several projects related to electronics packaging in cooeration with the Integrated Electronics Engineering Center (IEEC), which includes a broad range of industry as members. His expertise in micro/nanomechanics and optomechanics contributes to the center in conducting on-going and prospective projects.
Park began his professional career at IBM Microelectronics Division, where he conducted numerous analyses to put products out on time. Later, he was engaged in the reliability engineering responsible for the reliability of flip-chip technology and high performance packaging.
Park served as a panelist for the Yield Learning Conference hosted by IBM Academy of Technology. He spent over six years at the IBM Microelectronics Division in Endicott and East Fishkill, NewYork.
- Director of IEEC (Integrated Electronic Engineering Center)
- BS, MS, Seoul National University
- PhD, Purdue University
- Electronics MEMS packaging
- computer aided engineering