SEML - Electronics Assembly

MPM Momentum Screen Printer

MPM printer is a high-speed, high-precision systems for depositing precise patterns of solder paste on printed circuit boards through foil stencils.Solder Paste, a complex mixture of tiny particles of solder alloy and flux vehicle, is a challenging material to print onto a bare Surface Mount Technology (SMT) PCB. Solder paste printed deposits are essential to forming defect-free solder joints, the electrical and physical connections between electronic components and the PCB assembly.

MPM Momentum

Koh Young aSpire3 SPI

  • aSpire3 is a world-best performance 3D Solder Paste Inspection.
  • Industry-leading measurement accuracy and inspection reliability
  • Full 3D data-based process optimization solution: Realization of industry 4.0 / Smart Factory
  • Real-time process optimization through powerful SPC analytics

Koh Young aSpire3

Ekra Screen Printer

  • EKRA Serio 4000 printer is an economical inline system with a closed-loop print-head, stencil underside cleaning, the EKRA Vision Alignment System EVA and the iQUESS (quick exchange squeegee system).
  • Alignment repeatability ± 12,5 μm @ 6 Sigma
  • EVA TM – EKRA Vision Alignment System
  • Cycle time: 11/9 s + print
  • Print format up to 610 x 510 mm
  • Suitable for stencils up to 31 inch
  • Program changeover < 2 min

Ekra Screen

UIC Fuzion Mounter

  • Fuzion is a SMT equipment that picks electronic components from feeders and place on PCBs.
  • The FZ7 head quickly and accurately places components as small as 01005 up to 55mm square with single field-of-view inspection and up to 25mm tall.
  • Precision accuracy (27micro-meter @Cpk>1)
  • Place components up to 150mm with multiple fields of view.

UIC Fuzion Mounter

Koh Young Zenith PRE-AOI

  • Zenith is the world's best-selling &first full 3D Automated Optical Inspection.
  • Eliminates all the sources of defects using full 3D measuring inspection equipment skills.
  • Full 3D data-based process optimization solution: Realization of industry 4.0 smart factory

Kohn Young Zenith

Heller Reflow Oven

  • Heller 1700 model supports high mix/medium volume throughput at speeds up to 24 inches per minutes.
  • The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1'C.
  • Wide process window allows many different boards to be run on single temperature profile.

Heller Reflow Oven

Thermal Warpage Inspection system

  • Perform warpage inspection under reflow temperature or set temperature conditions, without the need for sample preparation such as bump removal nor paint treatment required by a general warpage inspection apparatus. Applicable work size is max. 100x100mm, and a high-speed convection heater capable of heating speed 3℃/sec is included.
  • Heating temperatures range from -55℃ to 260℃ (Target)