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The 30th annual Binghamton University and GE Electronics Packaging Symposium, the premier electronics manufacturing conference in the Northeast, features more than 40 invited technical presentations by academic, industry, and government leaders, influences and decision makers. The program includes an IEEE CPMT Society- sponsored workshop on Heterogeneous Integration, a student poster session and exhibits. 


Session topics will include: 

             Heterogeneous Integration
             Electronics Materials
             Thermal Challenges
             2.5D and 3D Packaging
             Power Electronics
             Flexible and Additive Electronics
             Sensors, Embedded Electronics and IoT
             Automotive and Harsh Environments
             Photonics and MEMS
             Materials for Energy Storage

For more information, please contact EPS Administrative Chair, Katelynn Hrywnak 

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 1/26/18