GE Research and IEEC-Binghamton University are proud to host our 31st Annual Electronics Packaging Symposium- Small Systems Integration.
We invite you to join us for this two-day event on September 5-6, 2019 at GE Research Center in Niskayuna, NY.
This symposium brings together leaders in academia, industry and government to discuss the current standing in the field of electronics packaging, and bring value from the varying viewpoints of each respective sector.
There are many pressing challenges that are found within this field as of today, and this symposium provides the grounds to discuss these pressing concerns in both the technical aspect, as seen in the session topics below, and larger scale aspect of market trend and future direction.
The program will also include workshops, student poster sessions, and exhibits to share and spread knowledge, and ultimately have those who attend walk away with invaluable knowledge, added value in career building opportunities, and having become an integral member in advancing the field of electronics packaging.
We hope to see you there.
Session topics for 2019 :
- 2.5/3D Packaging
- 5G Needs in Packaging
- Automotive & Harsh Environments
- Flexible & Additive Electronics
- Materials for Packaging & Energy Storage
- Power Electronics
- Sensors, Embedded Electronics & IoT
- Thermal Challenges
- Wearable and Flexible Electronics for Medical Applications
James (Jim) LeBlanc
Jim's current role is Director of Electronics research and development at the GE Research Center. He leads a team of 140 scientists and engineers covering a technology span that includes semiconductors, microelectronics, photonics, microsystems, and microfabrication tools and processes. He is responsible for managing all aspects of electronics technology development at Global Research and helping to drive strategic
technology planning for the GE businesses.
Prior to GE, Jim served for five years as a submarine officer in the United States Navy. He earned his bachelor's degree in nuclear engineering from the University of Washington, and following Navy service returned to graduate school at the University of Michigan where he received his master's and doctorate degree in nuclear engineering and radiological sciences.
Bahgat Sammakia, a SUNY distinguished professor of mechanical engineering, is the vice president for research at Binghamton University. A former IBM senior technical staff member, Sammakia joined Binghamton's faculty in 1998. He is the founding director of the Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence, and is the director of the Energy Efficient Electronic Systems Center, an NSF IUCRC founded in 2011 with a focus on reducing the energy consumed by data centers around the world. Sammakia earned his bachelor's degree from the University of Alexandria in Egypt and his master's and doctoral degrees from the University at Buffalo. He is a fellow of the American Society of Mechanical Engineers, the National Academy of inventors, and the IEEE. Sammakia holds 21 U.S. patents and has published more than 250 peer-reviewed technical papers. Sammakia, who received the SUNY Chancellor's Award for Excellence in Scholarship and Creative Activities in 2010, was honored with the 2010 ITherm Achievement Award for his contributions to the field of semiconductor thermal management.