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The 30th annual Binghamton University and GE Electronics Packaging Symposium, the premier electronics manufacturing conference in the Northeast, features more than 40 invited technical presentations by academic, industry, and government leaders, influences and decision makers. The program includes an IEEE CPMT Society- sponsored workshop on Heterogeneous Integration, a student poster session and exhibits. 


Session topics will include: 

• 2.5/3D packaging
• 5G needs in packaging
• Automotive and harsh environments
• Bioelectronics
• Flexible and additive electronics
• Flexible electronics for medical and wearable applications
• Materials for packaging and energy storage
• Photonics
• Power electronics
• Sensors and embedded electronics/ IoT
• Thermal challenges

For more information, visit or contact Katelynn Hrywnak

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 6/10/18