ADVANCING FORWARD, TOGETHER.
It is the curiosity, work ethics, and values behind people that drive innovation. An interrelated network of people with skill and the sharing of valuable knowledge is required to efficiently solve the complexities found in the field of electronics packaging.
The IEEC is uniquely positioned to house all of the above, and promotes the growth and development in people, the field, the industry, and the community.
We aim to:
CONNECT industry needs with opportunity for faculty and students through collaborative research projects.
IDENTIFY PROBLEMS and provide technical solutions to our clients.
TRAIN students and clients on cutting-edge equipment to add value to projects.
EDUCATE students through research.
RESEARCH to simplify and solve the challenges in electronics packaging, integrate AI, and advance towards Industry 4.0.
LATEST IEEC NEWS
SB Park Receives Clock Award at ASME Conference
Director SB Park of the IEEC was presented with the 2019 Clock Award at ASME's 2019
InterPACK Conference (International Technical Conference and Exhibition on Packaging
and Integration of Electronic and Photonic Microsystems) that took place October 7-9
in Anaheim, CA.
This award was presented by the K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division for Park's outstanding accomplishments and service to the field of Electronics and Photonics Packaging.
Benson Chan Receives iMAPS Outstanding Educator Award
Associate Director, Benson Chan, of the IEEC, was presented with the Outstanding Educator Award at iMAPs 52nd International Symposium on Microelectronics, which took place September 30-October 3, 2019, in Boston, MA.
This award is presented to an individual who has provided significant contributions to education, within or outside the realms of academia, for the electronics packaging industry and/or to the advancement of IMAPS Student Chapters.
iMaps is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Benson Chan is the president of the Empire Chapter of iMAPS and is active in organizing local workshops and meetings to connect members in upstate NY with topics pertinent to the evolving field.
Congratulations to Benson Chan for his active role and continued dedication in sharing knowledge with a community of students, faculty and members of organizations and industry.
2019 Electronics Packaging Symposium Poster Session Winners Recognized for their Excellence in Research
Congratulations to the student poster session winners who presented at the 31st Annual Electronics Packaging Symposium at Niskayuna, NY. 37 Students participated in the poster session and were able to meet and share their research with attendees from across disciplines in industry, academia and government.
First Place: Michael Woodcox and his research team
Second Place: Jiefeng Xu and his research team
Third Place: Arun Raj and his research team.
You may find out more about the winners in this article released in the Binghamton University News website.
Student and Faculty Recognized for Excellence in Research in the SEMLab
In celebration of the achievements made in our SEMLab, in partnership with Koh Young Techonology, a luncheon and a time of recognition took place on July 30. Seven faculty members and graduate students were recognized for their research contributions to the development of the lab.
A special congratulations to the four student recepients of the IEEC Award for Excellence in Research: Hongya Lu, Irandokht Parviziomran, Jong Ha, and Ke Pan!