A Message from the 2026 EPS Organizing Committee:
Our 37th annual Electronics Packaging Symposium will take place Sept. 9 and 10, 2026, at the Innovative Technology Complex at Binghamton University. We will focus on various aspects of electronic packaging and how advanced packaging is evolving toward a Chiplet future.
Registration link coming soon!
EXECUTIVE CHAIRS:
 |
Dr. Mukesh V. Khare Vice President, Semiconductor and AI Hardware IBM Research |
 |
Dr. Bahgat Sammakia Director, S3IP Binghamton University |
 |
Cliff Macklin Technology Director, Digital & Electrical Systems GE Research |