The 34th Annual Electronics Packaging Symposium will be a great venue to market products and services to over 250 decision makers and leaders of the electronics packaging industry.
The steps will be as follows:
1. SELECT A PACKAGE
2.SIGN UP & REGISTER
To be available in the Spring of 2023
3. SUBMIT LOGO/AD
- Submit company logo (JPEG) and company name as it should appear in print material.
- Submit a 7.5" X 10" color ad (.pdf or.jpeg file, 300 dpi or higher) for program book.
- Submit company name as it should appear in print material.
Submit to: email@example.com
For anyone wanting to ship their exhibit pieces
Please use the following address:
ATTN: Sathya Raghavan/Aakrati Jain (Can use either or both)
257 Fuller Road, Floor 3,
Albany NY 12203