Our 34th Annual Electronics Packaging will be held in-person this year at the Albany Nanotech Complex. Please check the main page for the speaker and session chair info.
On this page, we would like to share with you the speakers and session chairs who will participate in our 34th Annual Electronics Packaging Symposium. This page will fill up with speakers and session chairs as they are confirmed.
Session Chairs and Speakers
Session 0: Keynote Speakers - (Benson Chan, Nancy Stoffel)
Speaker: Dev Shenoy (DoD)
Title: Microelectronics Security: A Growing National Imperative
Speaker: James Lu (RPI)
Title: 3D HI of Chiplets: Current Landscape, Challenges and Future Perspectives
Session 1: Future of Computing for HPC / AI – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: Griselda Bonilla (IBM)
Title: Innovative Packaging Interconnects for AI Multi-chip Systems
Speaker: Joe Van Nostrand (AFRL)
Title: Emerging Technology for Neuromorphic Computing at the Edge
Speaker: Rajen Sidhu (AMD)
Title: Advanced Packaging – The Future of High-Performance Computing
Session 2: Photonics Packaging – John Mazurowski (Penn State Optical Lab)
Speaker: James Monroe (Allvar Alloys)
Title: ALLVAR Alloys: Novel Materials for Optics and Extreme Environments
Speaker: Colin McDonough (AIM Photonics)
Title: AIM Photonics’ Photonic Interposer Technologies
Speaker: Ronald Cok (X-Celeprint)
Title: Micro-Transfer Printing for Heterogeneous Integration and Micro-Assembly
Session 3: Thermal Challenges – Ramchandra Kotecha (GE Aerospace)
Speaker: Rinaldo Miorini (GE Research)
Title: A Novel Package-Integrated Cyclone Cooler (PICCO) for the Thermal Management of Power Electronics
Speaker: Srikanth Rangarajan (Binghamton)
Title: Thermal Management of High Power Electronics Using Liquid Cooling and Phase Change Materials
Speaker: Peter Debock (ARPA-E)
Title: ARPA-E COOLERCHIPS: Transformational Energy Efficient Computing
Session 4: Wearable and Flexible Electronics – Gurvinder Khinda Singh (GE)
Speaker: Woon-Hong Yeo (Georgia Tech)
Title: Flexible Wearable Sensors and Electronics for Pediatric Healthcare
Speaker: Christine Kallmayer (Fraunhofer IZM)
Title: Novel Materials and Technologies for Soft Robotic Grippers
Speaker: Zach Kiehl (Sentinel of Safety)
Title: Flexible Hybrid Electronics in the Wild: Wearable Sensors for Health & Safety Assessment
Session 5: Heterogeneous Integration – Liang Yin (GE)
Speaker: Suburamanian S. Iyer (UCLA)
Title: Advanced Packaging - Quo Vadis
Speaker: Douglas Hopkins (NC State)
Title: Investigation of High Current Fine Grain Power Devices for 3D Heterogeneous Integration
Speaker: Jack Lombardi (AFRL)
Title: Packaging Considerations for Neuromorphic Computing
Session 6: Substrates, Platform for Advanced Packaging – Marie Cole
Speaker: Mitsukura Kazuyuki (Resonac)
Title: Resonac Open Innovation Platform for Advanced Package
Speaker: Lars Bursburg (Corning)
Title: Advanced Glass Substrate for Co-packaged Optics
Speaker: Erik Jung (Fraunhofer IZM)
Title: Collective Wiring with Substrate and Substrateless Concepts for High Density Integration
Session 7: Flexible and Additive Electronics – Scott Miller (NextFlex)
Speaker: Canek Fuentes Hernandez (Northeastern)
Title: Flexible and Stretchable Organic Electronics for Power Autonomous Edge Technologies
Speaker: Jona Engel (Nanoscribe)
Title: Simplifying Photonic Packaging with Aligned 2-Photon Lithography (A2PL)
Speaker: Mohammed Alhendi (Binghamton)
Title: Advances in Printing and Electronics — from Concepts to Devices
Session 8: Power Electronics / Harsh Environments – David Shaddock (GE)
Speaker: Emad Andarawis (GE)
Title: Extreme Environment Electronics: Recent Progress Towards Electronics for Beyond 500°C Operation
Speaker: Sreekant Naramanchi (NREL)
Title: Power Electronics Packaging, Thermal Management and Thermomechanical Activities at NREL
Speaker: Stefan Behrendt (Danfoss Silicon Power)
Title: Inorganic Encapsulated Power Modules for WBG Applications with High Power Loss Density
