Speakers and Session Chairs

* We are currently in preparation mode for our upcoming Fall 2020 Symposium. In the meantime, you may find last year's list of speakers and session chairs to browse through.


2.5/3D Packaging

Image: Luke England
Luke England
Session Chair: Luke England

3D Manager, Globalfoundries

Image: Aric Shorey
Aric Shorey
Session Chair: Aric Shorey

VP Business Development, Mosaic Microsystems

Image: John Hunt
John Hunt
Speaker: John Hunt

Senior Director, Engineering, ASE Group

High Density Fan Out Alternative to 2.5D Interposers

With the development of the internet and the rise of the artificial intelligence industry, high-performance semiconductor integrated circuits have become an important product in the semiconductor industry.  Historically, the solution was to use 2.5D interposer packaging to achieve the necessary density. High Density Fan Out has been developed as a lower cost alternative to the standard 2.5D Interposer package. An overview of this Fan Out technology will be presented, as well as a comparison of a real case with an ASIC die and 2 HBM2 die packaged in both a 2.5D interposer structure and a Fan Out on Substrate structure

Bio: John is Senior Director Engineering, Marketing & Technical Promotion, at ASE Group, and provides technical support for the Introduction, Engineering, Marketing, and Business Development activities for Advanced Wafer Level and Fan Out Packaging Technologies at ASE.

John has more than 45 years of experience in various areas of manufacturing, assembly and testing of electronic components and systems, with emphasis on the development of new technologies and processes.  He has a B.S. from Rutgers and an M.S. from the University of Central Florida.

Image: Rahul Manepalli
Rahul Manepalli
Speaker: Rahul Manepalli

Sr. Director of Engineering, SPTD  & Sr. Principal Engineer, Intel Corporation

Advanced Packaging Technologies for Heterogeneous Integration: Challenges & Opportunities.

 Heterogeneous integration of multiple types of Integrated circuit chips on a single package is an emerging area in advanced packaging that has made significant to impact to High Performance Computing (HPC) devices. In this presentation, we will discuss the evolution of heterogeneous System in Package (SIP) packaging technologies. We will discuss key drivers and metrics for enabling advanced die to die and on package interconnect technologies . We will explore the existing heterogeneous SIP packaging technologies and challenges associated with meeting the needs of next generation HPC devices. Finally, we will cover the areas of innovation needed in materials, equipment, process and design in advancing the next generation of heterogeneous SIP packaging technologies.

Bio: Rahul Manepalli is a Sr. Principal Engineer and the Sr. Director of Module Engineering in Substrate and Package Technology Development Group in Intel Corporation. Rahul manages the Module Engineering group responsible for development of next generation Substrate and Package Technologies for all of Intel’s packaging needs. He has over 20 years of experience in Packaging (Assembly & Substrate materials, processes and modules) and has lead the startup and development of multiple Intel factories and Technology Development teams. Over the last decade, Rahul and his team have developed revolutionary breakthroughs in advanced packaging technologies leading to multiple generations of Intel’s EMIB platform for Heterogeneous on package integration. He holds over 50 + worldwide patents in the area of electronic packaging and has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.

Image: Alan Evans
Alan Evans
Speaker: Alan Evans

Program Director, Corning Optical Communications, Corning Incorporated

Better Interconnects Through Glass

Cloud services, new artificial intelligent applications, and the growing internet of things is dynamically increasing the need for greater compute and interconnect speeds within high performance supercomputers and hyperscale data centers.  Yet the saturation of computer clock speed, package escape bandwidth constraints, and high-speed signal integrity limitations contribute to a growing challenge for compute servers and interconnect switches.  New packaging strategies and materials are needed to keep up with low latency and bandwidth demands.  Glass has a unique combination of electrical, thermal, mechanical and even optical properties to be well positioned as a package or board-level substrate.  We will describe recent results highlighting these advantages and how they help solve these challenges.

Bio: Dr. Alan Evans has had a variety of R&D roles throughout his 27 years at Corning, Incorporated.  He is currently the Commercial Technology Liaison responsible for coordinating collaborations and supporting R&D activities related to integrated photonics for Corning’s Optical Communications business, leading Corning’s engagement with AIM Photonics, and directing a glass electronic packaging project for Corning Specialty Materials’ Advanced Optics business.  For 11 years, he led the Optical Physics and Transmission Technology Research directorate where he was responsible for Corning’s optics research with key programs in new optical fiber products and transmission understanding, value-added optical surfaces and advanced displays, novel optical measurement systems, and innovative laser processing techniques.  Evans received a Doctorate in Optics from the Institute of Optics, University of Rochester and has been awarded 31 patents.

Image: Rich Graf
Rich Graf
Speaker: Rich Graf

PMTS- Package Technology & Development, Globalfoundries Inc.

New Developments in 2.5D Packaging Technology

As the high end ASIC markets for data center and wired infrastructure continue to push the boundaries for functional content and increasing levels of memory integration, advanced packaging has paved the way for enablement of supporting products. Although 2.5D packaging with HBM integration has been in use for several years now, there is still a significant amount of package development required and learning needed to achieve true “mainstream” status. This presentation will highlight some of the recent 2.5D packaging development items, along with issues that were overcome as part of a joint development project between GF/Avera and ASE on the road to qualification of 2.5D products utilizing both standard and stitched Si interposer technologies.

Bio: Rich received his BS in Mechanical Engineering from University of Maine in 1999. He has worked in packaging development, CPI, and packaging product qualifications in IBM, GLOBALFOUNDRIES, and Avera Semiconductor. He is a certified Lean Six Sigma Master Black Belt. He was named a master inventor in IBM and in GLOBALFOUNDRIES, with 40 issued US patents to date. Rich is currently a principal member of technical staff for Avera Semiconductor, the ASIC turnkey division of GLOBALFOUNDRIES, focused on 2.5D and 2D packaging.

mm Wave in Packaging

Image: Steve Gonya
Steve Gonya
Session Chair: Steve Gonya

Lockheed Martin Fellow, Research Scientist

Image: Joe Iannotti
Joe Iannotti
Session Chair: Joe Iannotti

Senior Principal Engineer-RF Microsystems, GE Research

Image: Reena Dahle
Reena Dahle
Speaker: Reena Dahle

Assistant Professor, SUNY New Paltz

Millimeter Wave Packaging: Advances, Challenges and Trends

Millimeter-wave packaging is an important aspect of modern communication systems. Performance of these systems depend upon successful interconnections between subsystems, components, and parts. Since 5G systems rely on frequency bands approaching 100 GHz, special care must be exercised in their design that is not required for 3G/4G systems. This talk will provide an overview of the challenges and future directions of millimeter-wave packaging technology including essential information on materials, fabrication methods, transmission lines, interconnection methods, transitions, and integration methods such as 3-D packaging.

Bio: Reena Dahle received her Ph.D. degree from the University of Waterloo, Canada, at the Center for Integrated RF Engineering (CIRFE). She was extensively involved with RF MEMS device microfabrication and integration. Dr Dahle has authored and co-authored multiple scientific publications in the field. While working as a senior microwave engineer at MITEQ in Hauppauge, LI, Dr. Dahle oversaw the design of high-performance components and systems for satellite communication. She is currently an assistant professor at SUNY New Paltz. Her research interests include applications of 3-D printing to RF device design, wireless power transfer and NFC powering of passive implantable medical devices.

Image: Joseph Jendrisak
Joseph Jendrisak
Speaker: Joseph Jendrisak

RF Engineer Sr. Staff, Lockheed Martin Rotary and Mission Systems

Direct-Write Printed Millimeter-Wave Electronics

Hermetic hybrid Radio Frequency (RF) circuit technologies produce highly reliable devices with excellent electrical and thermal performance, typically performing better than equivalent surface-mount designs. The tradeoffs are complexity, size, weight, and cost. This presentation describes an approach providing the performance of a hybrid but with size, weight, and cost comparable to surface mount. Bare die are placed in an RF substrate and interconnects are made using aerosol-jet printed silver ink instead of wirebonds. Structures such as antennas, microstrip, couplers, inductors, and capacitors can also be printed. LM Owego has developed several demonstrator circuits and printed components and will present the simulated and measured performance results.

Bio: Mr. Jendrisak is a 1992 graduate from The Ohio State University with a Master of Science degree in Electrical Engineering. He joined IBM Federal Systems in Owego, NY (now part of Lockheed-Martin Rotary and Mission Systems) in October 1992 and has spent his career at Owego as a Radio Frequency (RF) engineer. Recently, he has become involved with flexible electronics using Liquid Crystal Polymer (LCP) substrate and 3D-printed RF structures such as microstrip lines, interconnects to bare die, couplers, baluns, inductors and capacitors. He has two patents pending and has co-authored a journal article on aerosol jet printed wideband bias inductors.

Image: Chuck Kryzak
Chuck Kryzak
Speaker: Chuck Kryzak

Integrated Mixed Signal Tx/Rx Sensor Array Building Block Architecture and Packaging Addressing DoD’s Multifunction Antenna Array and Integrated Topside

In order to meet DOD’s scalable Modular Electronically Steerable Array architecture, Alion/GE continue to develop and promote its heritage satellite VSAT ESA modular 8:1 and/or 8x2 element, i.e. 8 or 16 element subarray building blocks. The integrated mixed signal Sensor/Comms building incorporate dual-pol radiating elements, integrated digitally controlled analog beam forming, power combining, integrated band-pass filtering for Tx/Rx isolation, and integrated group-delay equalized LNA with gain block amplifiers

 The primary drivers for the modular array building block architecture address ease of assembly, environmental sealing, and system cost reduction early in the design cycle. The sub-array building blocks allow full functional test through electronical beam steering,  and rapid transition into future USSOCOM Deployable Electronically Steerable Antenna initiatives such as: “Ultra Small Electronically Steerable Array Satellite System”, Multimode Software Defined RF, and SATCOM SIGINT/ELINT/COMINT Multifunction RF Systems.

Bio: Chuck Kryzak retired 2015 Lockheed Martin Fellow and Hardware-Systems Architect under Ground Base Radar Systems in Syracuse, NY, and subsequently accepted a position as Technology Director/Principle RF Engineer with the Weapons Systems and Sensors Division of Alion Science and Technology in Rome NY. He received a Ph.D. in Physics from RPI, Troy, NY and jointly served as Research Assistant under the EE department.

As Technology Director he is systems PI for Alion’s adaptive spectrum selective RF jammer, and their Foliage Penetrating Radar development which includes polarimetric target discrimination, > 500MHz IBW, neural network based adaptive beam forming and multi-target tracking: insertions include autonomous UAV detection and threat mitigation, and remote occluded personnel surveillance.

Image: Mark Mirotznik
Mark Mirotznik
Speaker: Mark Mirotznik

Additive Manufacturing of Ceramics for Power and High Temperature Applications

A major challenge for many critical defense and commercial applications is finding material solutions capable of surviving extreme environmental conditions, such as high shock, high power and high temperatures while maintaining desirable electromagnetic and mechanical properties. Ceramics offers one material solution but is often difficult to form into complex three dimensional geometries. A promising solution is offered by the rapidly growing field of additive manufacturing (AM). In this presentation I will present some of our experience with ceramic AM, using the XJET technology, including measurements on the wideband dielectric properties as well as several electromagnetic and electronic applications.

 Bio: Mark Mirotznik received the B.S.E.E. degree from Bradley University in 1988 and the M.S.E.E. and Ph.D. degrees from the University of Pennsylvania in 1991and 1992, respectively. From 1992 to 2009, he was a faculty member in Electrical Engineering at The Catholic University of America, Washington, DC. Since 2009 he is a Professor and Associate Department Chair in Electrical Engineering at the University of Delaware, Newark DE.  He is the 2010 recipient of the Wheeler Prize for Best Application Paper in the IEEE Transactions on Antennas and Propagation.  His research interests include applied and computational electromagnetics, multifunctional materials and additive manufacturing.  

Automotive & Harsh Environments

Image: Emad Andarawis
Emad Andarawis
Session Chair: Emad Andarawis

Principal Engineer – Microelectronics, GE Research

Image: Gus MacDonald
Gus MacDonald
 Session Chair: Gus McDonald

Senior Expert-MEMS Technologies, Valeo North America Inc.

Image: Omar Manon
Omar Manon
Speaker: Omar Manon

External Module Technology Transformation Mission Based Team, GE Aviation

Optic Fiber Sensors on Aircraft Engines

Optic Fiber offers relevant advantages compared to current copper wire utilized across the Aircraft Engines. EMI immunity and reduced weight are few examples of this.

Aircraft Engines operating conditions demand Optic Fiber technologies to stretch their current telecom industry capabilities to withstand the environment these engines operate in. High temperatures and vibrations restrict the use of a COTS system.

Packaging solutions are key enablers to implement this technology on aircraft engines

Bio: Omar Manon is a GE Aviation Systems Integration Senior Engineer working on Advance Design Systems focused on identifying and mature the emerging technologies related to the hydraulics, pneumatics, electric, thermal and control disciplines that pose an opportunity to improve the capabilities of Aviation and Aeroderivative Engines.
MSc graduate from the University of Applied Sciences (FH) Esslingen in Germany in 2002, and BSc graduate from the Universidad del Valle de Mexico in 1998, Omar has been working for GE for the last 15 yrs. in the development of a wide range of engine components as stator structural components, actuation systems, sensors, harnesses, and systems integration for aircraft and aeroderivative engines.

Speaker: Fayçal Mounaïm

Business Development (Medical) / Application Engineer, Murata Electronics

Silicon Integrated Passive Device (Si-IPD): an integration platform with high performance capacitors enabling high temperature operation exceeding 250°C.

Murata Silicon Technology is a disruptive technology based on unique 3D silicon structures that enable the integration of high-density capacitors (SiCap) using a semiconductor MOS process and multiple metal-insulator-metal (MIM) layer stacks. Several SiCaps can be integrated as an array on a single die, eventually combined with resistors and/or inductors on the same substrate, thereby implementing a monolithic RLC network or a Silicon Integrated Passive Device (SI-IPD). A Si-IPD can be seen as a full passive integration platform enabling numerous and advanced assembly scenarios ranging from Multiple-Chip-Modules to SIP. Whether with wirebonding or flip-chip, a Si-IPD can be used as an interposer to mount other elements (e.g larger passives, active dies, ASIC, crystal, saw filter, diodes...) and implement a complete functional system in a miniature module. Murata Silicon Technology is one of the fastest growing technologies as SiCaps exhibit very interesting properties that lead to advanced solutions and better performance in diverse applications: high temperature operation for Automotive and harsh environments such as soil drilling for oil & gas, high reliability and miniaturization for Medical implantable devices, high signal & power integrity for Networking (RF power, Broadband) and Communications. SiCaps effective capacitance is highly stable over time and over the complete operating ranges of temperature (-55°C to 250°C max spec), AC voltage/frequency and DC voltage bias. SiCaps can be mounted with wirebonding or soldering as there are multiple pad's metal finishing options available (e.g Alu, Au, NiAu, TiWAu, ENIG, Copper) eventually adding SAC305 or C4 bumps, or copper pillars. Wirebonding has been the main solution for high temp applications, but high temp joints are now possible thereby not limiting the maximum temperature anymore. This is a major advantage for SiCaps over other technologies as maximum operating temperature currently specified up to 250°C is yet to be explored by new designs beyond 300°C. Additionally, SiCaps are beneficial for signal integrity thanks to very low insertion losses (up to 110GHz) when used for AC coupling, or for power integrity thanks to very low ESL when used for supply line decoupling. Last but not least, SiCaps/Si-IPD can be thinned down to 100um, or even less depending on the required capacitance, thereby offering a solution without compromise to compact and height-constrained designs.

In this presentation, we will describe the SiCap trench technology, the capacitance density versus breakdown voltage trade-off that defines a process node, the electrical/mechanical/reliability benefits and advantages, the higher level of system integration it enables, and examples of SiCaps/Si-IPD designs while focusing on selected cases of automotive and high temperature applications. We will also review the process nodes currently in volume production and the roadmap of upcoming ones

Bio: Fayçal Mounaïm graduated in electrical engineering from National Institute of Applied Sciences, Lyon, France in 2000 and received the Ph.D. degree in microelectronics dedicated to implantable medical devices from Ecole Polytechnique, Montreal, Canada, in 2013. He started his career in 2000 as RF analog designer on the first fully integrated silicon cable TV tuner at Philips Semiconductors, Caen, France. During his Ph.D, he worked as design & team leader of a bladder highly integrated neurostimulator project to transfer the technology from Polystim Neurotechnologies Lab to industry. Since 2011, he has been working for Murata Silicon Integrated Passive Solutions (formerly known as IPDiA) as field application engineer covering North America territory, and since 2018 as business development engineer focusing on medical implantable devices.

Image: David Rousseau
David Rousseau
Speaker: David Rousseau

Sr. Product Marketing Manager, LED Automotive, OSRAM Opto Semiconductors, Inc.

Considerations for automotive qualified laser's and LED's

LEDs, Vixels, and Lasers can be found in common everyday consumer applications.  With the growing trend of new lighting concepts in industrial and automotive applications, designers are faced with the task of evaluating and developing strategies to implement these innovations into more challenging environments.  This paper will review some of the key factors and system requirements needed to implement a successful LED illumination strategy for demanding applications.

Bio: David Rousseau is currently a product marketing manager at OSRAM Opto
Semiconductors responsible for automotive interiors, heads up display (HUD) and
automotive display backlighting. David has over 25 years experience working in the
automotive industry.
David joined OSRAM Opto Semiconductor in 2008. Prior to joining OSRAM David
worked in the automotive and display industry since 1988 with companies to include
Denso and Optrex.
Mr. Rousseau holds a B.S. degree in Electrical Engineering from the University of
Michigan, a M.S. degree in Industrial and Systems Engineering and a MBA from the
University of Michigan, Dearborn
Rousseau is married and lives in Farmington Hills, Michigan with his wife and two
children. He is an active SID member and is a triathlete.

Image: mark christensen
mark christensen
Speaker: Mark Christensen

Prismark Partners, LLC

Automotive Electronics: Market, Component and Packaging Trends

While automobile sales fluctuate from year-to-year, automotive electronics has been a rather dependable market with above-average growth rates, making it an attractive opportunity for suppliers.  Advanced driver assistance systems and environmental controls are particularly important drivers for the increasing electronics content per vehicle.  Novel systems, components and packaging technologies are being developed for automotive sensors, processors, actuators and man-machine interfaces.

Bio: Mark Christensen joined Prismark in 1992 and has worked on a wide variety of custom projects for clients throughout the supply chain of the electronics industry.  Early on, Mark established Prismark’s Teardown Analysis Program in conjunction with the IEEC at Binghamton University. 

For the past twenty years his primary focus has been on communications—wireless and wired— with custom projects investigating opportunities for suppliers of wireless systems, RF modules, and optoelectronics assemblies.

Mark Christensen has B.S. and M.S. degrees in the physical sciences from the University of Konstanz in Germany, as well as a Masters degree in Business Policy from the State University of New York at Stony Brook.


Image: Allyson Hartzell
Allyson Hartzell
Session Chair: Allyson Hartzell

Managing Engineer, Veryst Engineering

Image: Ahyeon Koh
Ahyeon Koh
 Session Chair: Ahyeon Koh

Assistant professor, Department of Biomedical Engineering, SUNY Binghamton University

Image: Yeonsik Noh
Yeonsik Noh
Speaker: Yeonsik Noh

Assistant Professor, College of Nursing/ Department of Electrical and Computer Engineering,

University of Massachusetts Amherst

A hydrophobic conductive CB/PDMS electrode for health monitoring in any environment: Evaluation on land and underwater

The benefits of electrocardiogram ECG recordings are well known, undisputed in dry conditions (on typical land environments), and provide a wealth of physiological information. Such information can be equally important in underwater environments where recommended exercising to patients who are suffering from lifestyle diseases (such as hypertension, obesity, and diabetes) in terms of ubiquitous health monitoring. The hydrophobic conductive electrode was revealed its performance to capture all high-fidelity ECG morphological waveforms without any amplitude degradation not only in dry condition, but also in different water compositions where fresh/unfiltered, chlorinated, and even salt water tested.

Bio: My research has been focusing on the development of wearable health monitoring devices and systems for the personalized home/mobile/ sports healthcare in daily life. The future research will be focused on the next generation personalized healthcare and health management strategy/ system based on Nursing Engineering approach to proper diseases and symptoms management. The Nursing Engineering is new multidisciplinary research, which will be intensively focusing on the healthcare field based on both Nursing and Engineering. Currently, we are focusing on the research for wearable application underwater by using hydrophobic polymer electrodes and the development of the underwater body sensor network.

Image: Hong Yeo
Hong Yeo
Speaker: Hong Yeo

Assistant Professor, Georgia Tech

All-in-one, wireless, stretchable hybrid bioelectronics for smart, connected, and ambulatory physiological monitoring

Commercially available health monitors rely on rigid electronic housing coupled with aggressive adhesives and conductive gels, causing discomfort and inducing skin damages. Also, research-level skin-wearable devices, while excelling in few aspects, fall short as concept-only presentations, due to the fundamental challenges in active wireless communication and integration as a single device platform. Here, we introduce the first demonstration of an all-in-one, wireless, stretchable hybrid electronics with key capabilities for real-time physiological monitoring, automatic detection of signal abnormality via a deep-learning, and a long-range wireless connectivity (up to 15 m). The strategic integration of thin-film electronic layers with hyperelastic elastomers allows the overall device to adhere and deform naturally with human body while maintaining the functionalities of the on-board electronics. The stretchable electrodes with optimized structures for intimate skin conformation are capable to generate clinical-grade ECG and accurate analysis for heart and respiratory rates while the motion sensor assesses physical activities. Implementation of convolutional neural networks for real-time physiological classifications demonstrates the feasibility for multi-faceted analysis with a high clinical relevance. Finally, in vivo demonstrations with animals and human subjects in various scenarios reveal the versatility of the device as both a health monitor and a viable research tool.

Bio: Dr. Yeo is a TEDx alumnus and biomechanical engineer. Currently, he is an Assistant Professor in the George W. Woodruff School of Mechanical Engineering and Wallace H. Coulter Department of Biomedical Engineering at Georgia Institute of Technology. His research focuses on the areas of nano-/microengineering, advanced soft materials, molecular interactions, and bio-electromechanical systems, with an emphasis on flexible hybrid electronics. Dr. Yeo received his PhD in mechanical engineering and genome sciences at the University of Washington, Seattle in 2011. From 2011-2013, he worked as a postdoctoral research fellow at the Beckman Institute and Frederick Seitz Materials Research Center at the University of Illinois at Urbana-Champaign. Dr. Yeo has over 50 peer-reviewed journal publications (Nature journals, Proceedings of the National Academy of Sciences of the United States of America, and Advanced Materials), 5 issued patents, over 40 recognitions in honors and awards, and more than 80 invited talks at professional seminars and conferences. Since 2014, he has received over 15 research grants (total ~2 million dollars), including federal, state, non-profit, university, and corporate funding. Dr. Yeo is a recipient of a number of awards, including Hanwha Non-Tenure Faculty Award, Samsung Global Research Outreach Award, Korea Institute for Advancement of Technology R&D Collaboration Award, BMES Innovation and Career Development Award, Finalist for Vilcek Prizes for Creative Promise, Virginia Commercialization Award, NSF Summer Institute Fellowship, Notable Korean Scientist Awards, and Best Paper Awards at ASME.

Image: Seung Yun Heo
Seung Yun Heo
Speaker: Seung Yun Heo

Graduate student,  Northwestern University 

Wireless, battery-free, millimeter-scale UV dosimeters

Ultraviolet radiation (UV) has a dose-dependent consequence on the skin health. Overexposure to UV is the primary cause of skin cancers, the most common type of malignancy in the United States. Although quantitative monitoring of UV exposure is important, current technologies are confined to use in laboratories due to unfavorable properties in bulk, weight, and accuracy. Here, an optoelectronics design with fully-passive and continuous detection mechanism and wireless operation serve as a basis for highly accurate, battery-free, miniature dosimeters. The platform consists of a system-on-a-chip with near field communication, a radio frequency antenna, photodiodes, supercapacitors, and transistors. Applications of this dosimeter can allow consumers to modulate personal UV exposure during day-to-day activity and reduce risks of overexposure in order to prevent sunburns and skin cancers.  

Bio: I completed my BS in Materials Engineering at University of Illinois at Urbana-Champaign in 2015. I am currently in the fourth year of my Ph.D in Biomedical Engineering at Northwestern University. My research pimarily focuses on developing wearable optoelectronic devices for monitoring in healthcare. My projects explorations center around developing millimeter-scale, battery-free, wireless, wearable devices for pulse oximetry, transcutaneous spectrophotometry, and light dosimetry.

Image: Azar Alizadeh
Azar Alizadeh
Speaker: Azar Alizadeh

Bio: A Principal Scientist at GE Research and a NextFlex Fellow, Dr. Azar Alizadeh leads several cross-functional teams of industrial and academic partners to develop wireless health and performance monitoring systems. The wearable sensing platforms developed by these teams enable vital signs as well as sweat and interstitial biochemical measurement capabilities and have the potential to revolutionize medicine and performance monitoring through early detection of illness, infection, fatigue and injury. Azar holds a PhD in physics, has co-authored 49 peer reviewed publications, and holds 19 US patents/patent applications.

Flexible & Additive Electronics

Image: Dave Shaddock
Dave Shaddock
Session Chair: Dave Shaddock

Electronics Packaging Engineer, GE Research

Image: Mark Poliks
Mark Poliks
Session Chair: Mark Poliks

Director, Center for Advanced Microelectronics Manufacturing (CAMM), SUNY Binghamton University

Image: Seokheun Choi
Seokheun Choi
Speaker: Seokheun Choi

Associate Professor, Electrical & Computer Engineering Dept., SUNY Binghamton

Powering Papertronics and Fibertronics with Biobatteries

With the rapid evolution of wireless sensor networks for the emerging Internet-of-Things (IoT), there is a clear and pressing need for flexible and/or stretchable electronics that can be easily integrated with a wide range of surroundings to collect real-time information. Those electronics must perform reliably even while closely - even intimately when used on humans - attached while deformed toward complex and curvilinear shapes. To achieve the stand-alone and sustainable operation of the sensor networks, a flexible, miniaturized biobattery can now be considered as a truly useful energy technology because of their sustainable, renewable, and eco-friendly capabilities. In this talk, Prof. Choi will provide his latest progress in the development of the bacteria-powered biobatteries and their applications. Details of the frontier research of paper- and textile-based biobatteries will be discussed

Bio: Seokheun “Sean” Choi is an Associate Professor in the Department of Electrical & Computer Engineering at State University of New York (SUNY)-Binghamton. Currently, he is running “Bioelectronics & Microsystems Lab” as a Director and “Center for Research in Advanced Sensing Technologies & Environmental Sustainability” as an Associate Director at SUNY-Binghamton. His current research focuses on next generation “Biosensing and Bioenergy technologies,” including self-powered biosensors, wearable and stretchable sensors, biobatteries, papertronics, and fibertronics. Over the years, he has secured funding over $2.5 million from NSF, ONR, and SUNY Research Foundation. He has authored over 100 journal and conference articles, two book chapters, and one book, and hold two U.S. patents.

Image: Pradeep Lall
Pradeep Lall
Speaker: Pradeep Lall

MacFarlane Endowed Distinguished Professor and Director, NSF-CAVE3 Electronics Research Center, Auburn University

Process-Property Interactions for Additive Printed Electronics under Extended-Time Print Runs

Traditionally, the printed circuit assemblies have been fabricated through a combination of imaging and plating based subtractive processes involving use of photo-exposure followed by baths for plating and etching to form the needed circuitry on rigid and flexible laminates. Additive electronics is finding applications for fabrication of IoT sensors.  The emergence of a number of additive technologies poses an opportunity for the development of processes for manufacture of flexible substrates using mainstream additive processes, which are now commercially available.  Aerosol-Jet printing has shown the capability for printing lines and spaces below 10 µm in width.  The Aerosol-Jet system supports a wide variety of materials, including nanoparticle inks and screen-printing pastes, conductive polymers, insulators, adhesives, and even biological matter.  The adoption of additive manufacturing for high-volume commercial fabrication requires an understanding of the print consistency, electrical and mechanical properties.  Little literature exists that addresses the effect of varying sintering time and temperature on the shear strength and resistivity of the printed lines.  In this study, the effect of process parameters on the resultant line-consistency, mechanical and electrical properties has been studied.  Print process parameters studied include the sheath rate, mass flow rate, nozzle size, substrate temperature and chiller temperature.  Properties include resistance and shear load to failure of the printed electrical line as a function of varying sintering time and varying sintering temperature.  Aerosol-Jet machine has been used to print interconnects. Printed samples have been exposed to different sintering times and temperatures. The resistance and shear load to failure of the printed lines has been measured. The underlying physics of the resultant trend was then investigated using elemental analysis and SEM.  The effect of line-consistency drift over prolonged runtimes has been measured for up to 10-hours of runtime.  Printing process efficiency has been gauged a function of process capability index (Cpk) and process capability ratio (Cp).  Printed samples were studied offline using optical Profilometry to analyze the consistency within the line width, line height, line resistance and shear load to study the variance in the electrical and mechanical properties over time.

Bio: Pradeep Lall is the MacFarlane Endowed Distinguished Professor with the Department of Mechanical Engineering and Director of the NSF-CAVE3 Electronics Research Center at Auburn University. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering and the Department of Finance.  He is a member of the technical and governing council of NextFlex Manufacturing Institute.  He is the author and co-author of 2-books, 14 book chapters, and over 600 journal and conference papers in the field of electronics reliability, safety, energy efficiency, and survivability.  Dr. Lall is a fellow of the ASME, fellow of the IEEE, a Fellow of NextFlex Manufacturing Institute, and a Fellow of the Alabama Academy of Science.  He is recipient of the Auburn Research and Economic Development Advisory Board Award for Advancement of Research and Scholarship Achievement, IEEE Sustained Outstanding Technical Contributions Award, National Science Foundation’s Alex Schwarzkopf Prize for Technology Innovation, Alabama Academy of Science’s Wright A. Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, SMTA’s Member of Technical Distinction Award, Auburn University’s Creative Research and Scholarship Award, SEC Faculty Achievement Award, Samuel Ginn College of Engineering Senior Faculty Research Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Thirty Best-Paper Awards at national and international conferences. 

Image: Mark Ronay
Mark Ronay
Speaker: Mark Ronay

CEO, Liquid Wire

Moving beyond PCB: Direct Chip attach on stretchable membranes using high density liquid metal interconnects.

Printed circuit boards have been a platform technology for virtually all electronic devices for the last 60 years. Despite increases in density and feature resolution, fundamental mechanical limitations remain. Emerging applications are demanding circuit boards (or more accurately membranes) that are pliable, conformable and even stretchable. Liquid metal “gels” can provide mechanically stable but stretchable high density interconnects and vias on a wide variety of polymer substrates. Able to support Surface Mount Technology and Direct Chip Attach, liquid metal printed circuit membranes enable a new class of conformal electronics with wide application in industries as diverse as medical wearables, robotics and aerospace.

Bio: Mark Ronay is the founder of Liquid Wire, a company dedicated to fluid phase interconnects for stretchable electronics. An electrical engineer and materials scientist by training, Mark has dedicated his career to bridging the gap between soft goods and electrical engineering. Liquid Wire provides technology and development services for putting circuits where others can’t.

Image: Scott Smith
Scott Smith
Speaker: Scott Smith

Sr. Principal Scientist, GE Research

Additive Manufacturing: Innovating for Medical Ultrasound Probes

Two additive manufacturing processes developed at GE Research are applied to ultrasonic transducer arrays.  First digital micro-printing (DMP), comprising the deposition, patterning, and curing of transducer acoustic stack layers, expands the acoustic design pallet. Both piezoelectric(PZT) and acoustic matching layers with impedances ranging between 2-9 MRayls with thickness control of a few microns have been demonstrated. Second, aerosol-jet direct-write (DW) prints conductive traces for electrical connections between the acoustic stack and imager electronics.  DW provided design flexibility in depositing fine line (50-200 um), conductive traces over relatively complex substrate geometries. Moreover, these structures are more robust than earlier flex circuit alternatives.

Bio: Scott Smith has spent his career at GE Research mostly in ultrasound transducers.  Initially he developed high sensitivity phased arrays for echocardiography. Recent interests include matrix and electronic volumetric imaging arrays, adaptive acoustics, and additive probe fabrication methods.   Despite being trained as a physicist, he is a Fellow of the IEEE where he serves as Associate Editor of the Transactions on Ultrasonics Ferroelectrics and Frequency Control, and will serve as General Co-chair of the 2020 International Ultrasonics Symposium.   Throughout his career, he has been fortunate to work with, and learn from, teams of motivated and creative scientists and engineers.

Materials for Packaging & Energy Storage

Image: Martin Yan
Martin Yan
Session Chair: Martin Yan

Principal Engineer, GE Research

Image: Charles Arvin
Charles Arvin
Session Chair: Charles Arvin

Packaging Development Senior Engineer, Master Inventor, IBM Corporation

Image: Watson Tseng
Watson Tseng
Speaker: Watson Tseng

Vice President-R&D, Shenmao Technology Inc.

New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly

SAC305 is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temperature increases. This transformation in the assembly industry impacts the component requirement, the deformation probability (warpage) of a flat component is increased, which impacts the production yield. A lead-free, low-temperature SMT solder is needed to resolve this dilemma.

Low-temperature SMT assembly refers to the reflow process with peak temperature less than 180°C. The new process provides a few advantages like reducing energy consumption, reducing BGA component warpage during reflow and diminishing non-wetting open (NWO) and head-on-pillow (HoP) defects. The SnBi alloy is one of the candidates used in low-temperature SMT assembly.

There is several drawback of SnBi alloy. Its brittle characteristics will degrade the reliability of the assembly. Hot tearing is another joint defect impacting the reliability. A mechanical-improved SnBi alloy, Sn57Bi1AgX, had been introduced in this presentation. Sn57Bi1AgX had been applied on branded laptop and tested for its reliabilities. A regular product certification procedure was conducted on the samples. The results show that Sn57Bi1AgX is fulfilled the industry standard.

Bio: Mr. Watson Tseng has been with Shenmao Technology since 2001, and is Vice President of R&D and General Manager of Shenmao America. He has more than 16 years of experience in the development of fluxes, alloys, and solder pastes for SMT and semiconductor industries. Mr. Watson received his master’s degree and bachelor’s degree in Chemical Engineering from the National Taiwan University.

Image: Yuepeng Zhang
Yuepeng Zhang
Speaker: Yuepeng Zhang

Principal Materials Scientist, Argonne National Laboratory

In-situ Synchrotron Characterization of Nanofiber Synthesis for Solid-state Battery Applications

Solid-state lithium batteries have been identified as the next-generation form of high performance energy storage due to their nonflammable solid-state electrolytes (SSEs) and high energy density. As compared to bulk ceramic SSEs, nanofiber SSEs have multiple advantages relative to device integration, charge carrier conductivity, and charging rate, which results from their nanocrystalline nature and long-range continuous conduction channels. In this presentation, synthesis of nanofiber electrolyte materials under in-situ synchrotron-based small angle X-ray scattering will be discussed, which shows significantly reduced development time and cycles. 

Bio: Dr. Yuepeng Zhang is a Principal Materials Scientist at Argonne National Laboratory with expertise in functional nanomaterials, thin films, and small-scale hybrid device development for RF and energy-storage applications. Her research experience includes roll-to-roll synthesis of nanowires and non-woven structures, miniaturized RF components and devices, heat-assisted magnetic recording media, 3D magnetic sensors, nanocomposite exchange-spring magnets, and magnetic shape memory thin films. Before joining Argonne, Yuepeng worked as a Principal Engineer for Western Digital Corporation. 

Image: Alan Rae
Alan Rae
Speaker: Alan Rae

Director, NYS Center of Excellence in Materials Informatics, SUNY at Buffalo

Materials Informatics and the Electronics Industry

Materials Informatics is the practical application of data driven processes to support materials-based processes.  We will discuss the relevance of this to materials and systems for electronic packaging and interconnection.

Bio: Alan Rae has a background in ceramics, electronics and general management in international business, startups and not-for-profits.  As Executive Director of IncubatorWorks (and now Co-Director) he led the turnaround of this successful not for profit with incubators in Alfred NY and Corning NY.  As Interim Director of the Center for Advanced Ceramic Technology at Alfred University he led the successful reauthorization of the Center. He is now Director of the NYS Center of Excellence in Materials Informatics at SUNY Buffalo working to support NY companies use data-driven processes to improve materials, products, processes and sustainable product lifecycles.

Image: Michael Badding
Michael Badding
Speaker: Michael Badding

Senior Research Associate, Corning Incorporated

Thin, Flexible Ribbon Ceramics

Recently, Corning has developed a new manufacturing method that enables the production of fully dense and fine-grained ceramic materials in thin, flexible roll format, referred to as Corning® Ribbon Ceramics.  For the first time, sintered self-supporting ceramic ribbons are fabricated in long lengths (> 10 m).  Ribbon Ceramics are presently manufactured, at a development scale, in roll form at 20 to 80 µm thick, up to 100 mm wide and in two compositions: high purity alpha-alumina and tetragonal yttria-stabilized zirconia.  In this presentation, properties and potential applications of thin, flexible ribbon ceramic materials will be reviewed. 

Bio: Dr. Michael Badding is a Senior Research Associate, Crystalline Materials Research at Corning Incorporated.  Dr. Badding is the technical leader of Corning’s Ribbon Ceramics program with twenty-seven years of industrial research experience in the field of ceramic materials and processing with a focus on thin, flexible ceramics and their applications.  Prior to joining Corning in 1997, he held positions at AT&T Bell Laboratories and Sage Electrochromics.  He graduated from Cornell University with a PhD in Solid State Chemistry and holds thirty-nine US patents and has authored over thirty publications.


Image: David Lin
David Lin
Session Chair: David Lin

Principal Engineer-Microsystems, GE Research

Image: Shafi Saiyed
Shafi Saiyed
Session Chair: Shafi Saiyed

Sr. Package Development Engineer, Analog Devices Inc.

Image: Allyson Hartzell
Allyson Hartzell
Speaker: Allyson Hartzell

Managing Engineer, Veryst Engineering

The Importance of MEMS Cavity Gas Composition

MEMS are still occasionally packaged in large ceramic packages for custom applications, but most commercial MEMS are packaged in small multichip packages.  As MEMS are movable structures, most need a sealed hermetic environment for yield and reliability concerns.  This environment is provided by capping the structure in a controlled gas environment.  Large cavities can be gas composition tested with traditional RGA methods, yet small nanoliter sized cavities have problems with the traditional testing methods.  This talk will cover the various methods for testing gas composition in MEMS cavities over a volume size range.  Yield and reliability failure mechanisms will be shared when the gas composition is incorrect.  New packaging with in-situ sensors and getters will be shared.

Bio: Ms. Allyson Hartzell is a consultant at Veryst Engineering with 37 years’ experience in emerging technologies. Ms. Hartzell is an internationally recognized expert in MEMS reliability and has expertise in packaging, surface chemistry and analytical techniques for failure analysis.  Ms. Hartzell was the Director of Engineering for Reliability, Failure Analysis, and Yield at Pixtronix/Qualcomm.  She was a Senior Staff Scientist in Reliability and Yield at Analog Devices Micromachined Products Division, and has worked at IBM and Digital Equipment Corporation, as well as a myriad of MEMS start-ups.  Allyson authored the textbook “MEMS Reliability”. She earned a ScB in Materials Engineering from Brown University and a ScM in Applied Physics from Harvard University.

Image: Marco Aimi
Marco Aimi
Speaker: Marco Aimi

Technology Manager-Microsystems, GE Research

From Circuit Breakers to RF interposers: A MEMS Switch journey
The history of MEMS switch technology at GE Research has spanned multiple applications over the years which has given the technology unique attributes based on the specific path of realization. This presentation will describe some of the key influences on the technology and how the journey has led the team into exciting new areas of development. The current state of R&D will be discussed along with details of our most recent work on glass and fused silica RF interposers based off of the MEMS switch technology platform.

Bio: Dr. Marco Aimi joined GE Research Center in 2005 as a Materials Scientist researching new fabrication processes for MEMS devices. Over time he expended his role to include the mechanical and electrical design of both the MEMS transducer and overall Microsystem. Marco led several programs including the multi-year effort to build and productize high power RF MEMS switches along with the transition of a MEMS production process into GRC. Currently, Marco is the Technology Manager for Microsystems at GRC and works with the team to enable Microsystem based solutions with a focus on high performance and reliability in harsh environments.

Image: Jeremy Popp
Jeremy Popp
Speaker: Jeremy Popp

Vice President & Co-founder, InertialWave Inc.

Packaging and ASIC Co-integration for High Performance Inertial Sensors

Abstract: This talk will describe state of the art high end MEMS inertial sensors and associated packaging and electronics integration challenges.  High end inertial sensors require a combination of high vacuum packaging, stress isolation, and careful integration with their controller electronics to achieve beyond tactical grade performance.   Co-integration of MEMS with ASIC-based controller electronics and incorporation of advanced processes such as Wafer Level Packaging and System in Packaging will be discussed.  InertialWave’s development of high performance ASIC gyroscope controller technology for GE’s MEMS inertial sensor technology will also be highlighted.

Bio: Jeremy Popp is the Vice President and co-founder of InertialWave Inc where he leads
development of inertial sensor ASIC products. Jeremy has 21 years experience developing
high-performance mixed signal ASIC technology and MEMS inertial sensors. Jeremy was
previously an Associate Technical Fellow at Boeing where he developed ASICs for Boeing
systems and lead the navigation grade MEMS gyroscope sensor R&D. He has also been a
key contributor on several government advanced technology development programs.
Jeremy received his BSEE Portland State University and Masters EE from UC San Diego.
He has 26 technical publications and holds six patents.

Image: Haifeng Zhang
Haifeng Zhang
Speaker: Haifeng Zhang

Miniaturized Langasite MEMS Resonant gas sensors

 In this paper, we propose a compact lanthanum gallium silicate (langasite, La3Ga5SiO14) micro-electromechanical systems (MEMS) cantilever resonator fabricated with surface micromachining technique. Finite-element modeling tool is employed to investigate the electrical performance of MEMS resonator. Thickness shear mode cantilever resonators with different geometrical dimensions are designed and simulated. Various piezoelectrically induced resonant frequency is achieved with varied thickness. Detailed fabrication process has been developed and optimized, the structured langasite resonator is fabricated to demonstrate the efficacy of developing high performance gas sensor with Langasite MEMS resonator used in the harsh environment of turbine-engine combustion chamber. The measurement results exhibit that the miniaturized piezoelectric (pMEMS) resonator works at 48.2 MHz and achieves good quality factor of 1840, proving its potential applications in developing gas sensors.

Bio: Haifeng Zhang is currently an Associate Professor of Mechanical and Energy Engineering at the University of North Texas (UNT). He received his B.S. degree in engineering mechanics from Hunan University in 1997, his M.S. degree in solid mechanics from Northwestern Polytechnical University in 2001, and his Ph.D. degree in engineering mechanics from the University of Nebraska–Lincoln (UNL) in 2007. After a postdoctoral experience in the Department of Material Science and Engineering at the Ohio State University- Columbus, he joined UNT in 2008. His research interests are associated with advanced sensors, energy harvesters, structural health monitoring and d nondestructive testing methods. Dr. Zhang’s research focus on advanced sensors for harsh environment, energy harvesting and structural health monitoring. His research has been sponsored by several federal funding agencies, including National Science Foundation (NSF), U.S. Army Research Office (ARO), Department of Defense (DoD), U.S. Army NATIC, U.S. Department of Agriculture (USDA), and Department of Energy (DOE). He is the member of ASME Adaptive structure and materials branch and the Member of the ASME Energy Harvesting Technical Committee (EHTC),


Image: James Sutherland
James Sutherland
Session Chair: Jay Sutherland

Research Associate, Corning R&D Corporation

Image: John Mazurowski
John Mazurowski
Session Chair: John Mazuroski

Fiber Optics and Photonics Department, Penn State Electro-Optics Center

Image: Anis Rahman
Anis Rahman
Speaker: Anis Rahman

President & CTO, Applied Research & Photonics, Inc.

 Knowledge Gaps and Challenges for Nanotechnology Commercialization and a Solution via Terahertz Camera-less Imaging Route

Nanomaterials will play a key role in the next generation of electronics including the high-density packaging and interconnects. However, progress in commercial utilization of nanomaterials requires deeper understanding of these materials and their interactions with other materials. For example, the most critical knowledge gaps and challenges hindering commercialization include measurements and standards for manufacturing, characterization of nanomaterials, interactions between nanomaterials and the bulk, dewatering and drying (when appropriate), management of interfacial properties, and environment, health, and safety (EHS) considerations.

The terms “measurement” and “characterization” are differentiated only by the extent of analysis. Measurement or Metrology is the basis for all characterization. “Measurement,” indicates the routine analytical work necessary for manufacturing and quality control, and for compliance with environmental, health, and safety (EHS) regulations. “Characterization,” on the other hand, is the detailed analysis to define the key properties of a given material and usually not done on a routine basis.

A modern characterization lab requires millions of dollars to procure necessary instruments. So, could there be a way to do all necessary measurements in a more comprehensive yet in a cost-effective way? The principal disadvantages of the existing methods are capital cost, length of time required for sample preparation and measurement (several hours to days), high level of technical expertise required, and high facility construction costs due to special environmental requirements for many of the instruments in terms of acoustic and mechanical vibrations, electromagnetic fields, etc.

In this talk, an alternative measurement technique is described in terms of terahertz camera-less imaging and spectroscopic route. A few practical examples are used to outline specific issues and their practical solutions.

Bio: Dr. Anis Rahman is an acclaimed scientist in the field of semiconductor and nanotechnology. He is a winner of many scientific awards including NASA Nanotech Brief’s “Nano-50” award twice; CLEO/Laser Focus World’s “Innovation award;” and “2015 MP Corrosion Innovation of the Year,” by the NACE. Anis is the founder of Applied Research & Photonics (ARP) a leading terahertz company located in Harrisburg, Pennsylvania (see http://arphotonics.net). His invention of “Dendrimer Dipole Excitation,” a new mechanism for terahertz generation, makes it possible to generate high power terahertz radiation. With this his company has demonstrated camera-less lattice resolution 3D imaging with sub-surface analysis of semiconductors and nanomaterials. Anis is a recognized scientific leader and member of professional organizations including the SEMI, American Chemical Society (ACS) and The Optical Society of America (senior member). He is the chair of the optical metrology technical group of the OSA and the past chair of the Small Chemical Businesses Division of the ACS (www.acs-schb.org). He has also received awards from other scientific organizations such as OMICS International keynote recognition; Center for Dermal Research of Rutgers University; Center for Entrepreneurial Leadership award by the Juniata College of Pennsylvania. Anis lives in Hummelstown, Pennsylvania with his family.

Image: Nick Psalia
Nick Psalia
Speaker: Nicholas Psaila

3D laser written glass components for advanced photonic packaging

The persistent drive for increased bandwidth and density while simultaneously reducing cost in datacenter optical communication systems is placing substantial pressures on component manufacturers to increase the level of integration and adopt more efficient and lower cost assembly processes

Ultrafast lasers offer a unique tool for the integration of photonic components in this application. The talk will show how this can be used for manufacturing glass-based interconnect components, which are applied to both fiber-fiber and fiber-transceiver applications.  The talk will show how these components can be used as optical interfaces or further combined with conventional processes to help solve challenges in the packaging of photonic components.  In addition to this the talk will also show how these components can be used as integration platforms for optical sub-assemblies and photonic-electronic interposers.

Bio: Nick Psaila is co-founder and CEO of Optoscribe Ltd.  He is an expert in the manufacturing and use of photonic technologies in optical communications, with a particular focus on laser based manufacturing techniques.  He is responsible for both strategic and technical facets of the business and has led the company from its formation.

Nick has a PhD in Photonics from Heriot Watt University, an MSc in Photonics and Optoelectronic Devices from St Andrews University and BSc in Physics from Imperial College London.  In 2010, he was awarded an Enterprise Fellowship from the Royal Society of Edinburgh.  He has co-authored more than 60 publications and several patents in the field of laser based manufacturing.

Image: Charlie Kuznia
Charlie Kuznia
Speaker: Charlie Kuznia

President, Ultra Communications, Inc.

Fiber Optic Components for Harsh Environment Applications

  We present fiber optic components and technology for harsh environment application, such as aerospace and shipboard.  This includes digital transceivers and RF over fiber components, and high-resolution optical time domain reflectometer (OTDR) integration into fiber optic transceivers.  Transceivers with built-in-test (BIT) OTDR can characterize the fiber plant and isolate faults to reduce network installation and maintenance costs.   We present embedded OTDR technology applied to network security, for the detection of network configuration changes.

Bio: Charlie Kuznia, President of Ultra Communications. Ultra-Communications develops active fiber-optic data and RF communication products for harsh environment applications. Charlie as a BSEE from the University of Minnesota, and Ph.D EE from the University of Southern California. Charlie has 25+ years of experience in the areas of integrated optoelectronic/VLSI systems, free-space and fiber optic interconnects. He has over 25 technical publications in the areas of integrated optoelectronic/VLSI systems, free-space and fiber optic interconnects, and diffractive micro-lens array and grating design. He has 11 issued patents and 5 patents pending.

Image: colin mcdonough
colin mcdonough
Speaker: Colin McDonough

Photonic Interposer Technologies

Silicon (Si) interposers form the core of SUNY Polytechnic Institute’s 3D packaging ecosystem due to their scalability and flexibility for electronic and optical interconnection.  State-of-the-art photonic interposers are offered in either passive or active varieties.  Passive interposers utilize a fully hybrid integration approach for optical and electrical connection of various photonics and electronic components.  The next generation of photonic interposer is underway with the transition to an active interposer.  By heterogeneously integrating the photonic circuits directly on the interposer, we simultaneously increase performance while decreasing packaging complexity.

Bio: Colin McDonough is Technical Lead for Interposer Technology in the Derivatives Engineering Technology Development team at the SUNY Polytechnic Institute in Albany, NY.  Colin focuses on the integration of silicon photonics and interposer technologies.  He has lead development efforts in 3D integration including TSV stress mitigation, wafer-to-wafer fusion bonding for electro-optic heterogeneous integration, and low-loss waveguides.  Colin earned his Ph.D. in Nanoscale Science & Engineering in 2011 at the University at Albany, State University of New York.  He is currently the chair of the IEEE Schenectady Section.

Power Electronics

Image: Arun Gowda
Arun Gowda
Session Chair: Arun V. Gowda

Principal Engineer-Electronics, GE Research 

Image: David Benning
David Benning
Session Chair: David Benning

Process Development Director, Danfoss Silicon Power GmbH

Image: Aylin Bicakci
Aylin Bicakci
Speaker: Aylin Bicakci

Senior Process Development Engineer, Danfoss Silicon Power GmbH

Thermal benefit of power modules with organic insulation layer

The ever-increasing power density in power electronics results in ever higher temperatures of the semiconductors in power modules. This fact leads to a performance limitation of today's modules. The standard modules, which are available in the market, are not designed optimally from a thermal point of view due to the shear-sensitive Direct Copper Bonded Substrates (DBC) used in standard power modules. A sufficient thermal spread cannot be achieved.

As a consequence of the high fracture sensitivity the ceramic layers for electrical isolation in the DBC, such as aluminum oxide (Al2O3), cannot be designed thinner and the copper layers on which the semiconductors are contacted cannot be designed thicker. If this would be possible the thermal resistance of the overall structure could be reduced by the thinner insulation layer and the thermal spread could be increased by using thicker copper layers directly underneath the semiconductor. Then, the thermal spread would directly take place in the copper layer below the semiconductor instead of the base plate like in the current state of the art. This leads to a reduction of the semiconductor’s temperature and thus to an increased performance of the module.

Bio: In 2012 Aylin Bicakci obtained her bachelor’s degree (B.Eng.) in Mechatronics at the University of Applied Sciences in Kiel, followed by a master’s degree in Electrical Technologies (M.Eng.) in 2014. Ms. Bicakci joined Danfoss Silicon Power GmbH in August 2018 after she finished her PhD in power electronics with the title “Thermal investigation of circuit carriers for power electronic semiconductor modules with organic insulator” at the Technical University in Berlin together with the University of Applied Sciences in Kiel. She is now part of the process development team at Danfoss Silicon Power GmbH in Flensburg, responsible for new process technologies.

Image: Christopher Bayer
Christopher Bayer
Speaker: Christopher Bayer

Group Manager Packaging and Modules,  Fraunhofer IISB, Erlangen

Future Packaging Technologies in Power Electronic Modules

Due to upcoming demands including further integration, minimization, modularization, high temperature and high voltage capability, recent packaging topics are addressed and researched. Besides a deeper insight into interconnection technology topics, high switching speed by RC-snubber devices and high current copper projection welding are presented. Main topics are ceramic embedding by subtractive manufacturing processes for harsh environments and best semiconductor electrical interconnect, selective sintering of power electronic devices on organic circuit carriers for higher process flexibility, higher powers and long lifetime, as well as direct bonding without sinter or solder material as a novel interconnection technology in power electronics.

Bio: Christoph Friedrich Bayer received a German Diploma in physics engineering with specialization on nanostructure technologies from the University of Würzburg in 2011. Afterwards he joined the Fraunhofer Institute for Integrated Systems and Device Technology, Erlangen, Germany. There he worked on electrical, thermal, and mechanical simulations for applications in power electronics and power electronic modules while pursuing his Doctoral degree. After 3 years in the department of simulation he left the technology simulation group. In exchange he went on researching for the devices and reliability department in the packaging group. In 2017 he took lead of the packaging group focusing topics such as new power module designs, packaging technologies as well as corrosion and environmental resistivity.

Image: Christina DiMarino
Christina DiMarino
Speaker: Christina DiMarino

Assistant Professor, Virginia Tech

Packaging of high-voltage wide-bandgap power semiconductors

The ability of high-voltage wide-bandgap power semiconductors to efficiently switch higher voltages at greater frequencies has the potential to revolutionize medium- and high-voltage systems. However, present power module packages are limiting the performance of these advanced switches. New packaging techniques and materials are needed to create a high-density package that addresses the electromagnetic and thermal challenges, as well as the new and more prominent issues of high electric fields and electromagnetic interference, that are associated with high-voltage wide-bandgap power devices. This presentation will discuss the design, fabrication, and testing of an optimized package for 10 kV SiC power MOSFETs.

Bio: Christina DiMarino is an assistant professor in the Bradley Department of Electrical and Computer Engineering at Virginia Tech. She joined the Center for Power Electronics Systems (CPES) at Virginia Tech in 2012 as a direct Ph.D. student. In 2014, Christina earned her Master’s degree at CPES for her work on the high-temperature characterization of silicon carbide (SiC) transistors. In 2018, Christina received her Ph.D. at CPES for her work on the packaging of 10 kV SiC power MOSFETs.

Speaker: James Wertin

Manager, Technical Solutions – Americas

 Power Cycling Investigation of Failure Mechanisms of Sintered Die-Top Systems

Die Top System is an engineered solution resulting from a collaboration between Danfoss and Heraeus Electronics based on the “Bondbuffer” Technology.  By enabling thick copper wire bonding this solution offers extensive increases in current carrying capability, junction temperatures, and power module lifecycle over historic assembly methods.

 This presentation focuses on typical failure modes when using Die Top System, compares reliability results with state of the art assembling technique and offers an alternative method to further speed up reliability testing with active power cycling.

Bio: Mr. Wertin has been with Heraeus Electronics since 2014, where he manages
the Technical Solutions & Applications Support group for the Americas, specializing
in advanced manufacturing/process development techniques and materials
development, with focus on defect mitigation for component packaging and PCB
He has a background in circuit board and electronic design with extensive advanced
manufacturing/process development experience. In his career, he has spent 16
years in electronic manufacturing, managing manufacturing and process
engineering development and support teams, and 18 years in assembly materials
development, supporting applications for military, medical, industrial, photonic and
consumer electronics manufacturers.

Sensor & Embedded Electronics/ IoT

Image: Benson Chan
Benson Chan
Session Chair: Benson Chan

Associate Director-IEEC, Binghamton Univeristy

Session Chair: Hilary Lashley Renison

Senior Manager - Product Analytics

Image: Mark Bachman
Mark Bachman
Speaker: Mark Bachman

Chief Technical Officer, Xidas Incorporated

Integrated Devices for Smart Edge Applications

3D heterogeneous integration (3DHI) is emerging as a powerful manufacturing paradigm for building highly functional modules in a small package form factor. Indeed, we see this technology as an opportunity to move from “system-in-package” to “everything-in-package”. At Xidas Corporation we utilize 3DHI processes to build functional actuators, sensors, microstructures, and microfluidic devices. Many of our products require the development of new technologies, such as integrated substrates, high aspect-ratio interposers, and compliant metal structures. We report on several types of sensors and actuators, and introduce new processes to the 3DHI toolbox in order to build smart microdevices in small packages.

Bio: Mark Bachman serves as Chief Technical Officer of an IoT startup Xidas. He is also a University lecturer, professional speaker, and technology consultant. Dr. Bachman’s expertise is in micro-engineering, micro-medical devices, sensor network systems, and edge computing. He has worked in this area for 20 years as researcher, faculty, and entrepreneur. Dr. Bachman has published over 90 peer reviewed articles, has 12 patents issued, has testified before Congress on IoT, and has given scores of invited presentations around the world. Dr. Bachman earned a B.S. in Physics and a Ph.D. in Physics from the
University of Texas at Austin.

Image: Charles Woychik
Charles Woychik
Speaker: Charles Woychik

Chief Scientist, i3 Microsystems, Inc.

The Future Direction of Packaging: Heterogeneous System-in-Package (HSIP)

 Phase change materials (PCMs) have attracted the attention of researchers for their promise to buffer or mitigate the effects of transient thermal pulses within electronic systems.  One impediment to deploying PCM-enhanced packaging is a lack of package-level design tools that can illustrate the tradeoffs between performance, size/weight, and cost that results from integrating phase-change materials and/or their composites.  This talk exhibits the extensions made to the Army Research Laboratory’s thermal-mechanical co-design tool, ARL ParaPower to enable both phase change transient modeling and integration into system-level design tools.  By providing rapid surveying capability within any particular design space, simulation burden is reduced and the most promising demonstrators are prioritized.

Bio: Charles Woychik is the Chief Scientist at i3 Microsystems  in St. Petersburg, FL.  Previously he was the Senior Director of 3D Technology for Invensas Corporation.   Prior to Invensas, Chuck worked 5 years for General Electric Global Research, after spending the first 18 years of his career with IBM. His area of expertise is materials and processes for electronics packaging.  He holds a Doctorate and Masters of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor’s of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 113 issued US patents to his credit.  

Image: Michael Carpenter
Michael Carpenter
Speaker: Michael A. Carpenter

Interim Dean, College of Engineering, SUNY Polytechnic Institute

Harsh Environment Compatible Multivariable Chemical Sensors

Monitoring the levels of combustion related gases requires multivariable sensing
materials with demonstrated stability and resilience. Au nanoparticles (AuNPs) have shown potential in plasmonic gas sensing applications. Encapsulation of the AuNPs in 2D metal oxides enables the detection of target gases within a multivariable sensing array or a single sensing element design. Recent multivariable sensor platforms which utilizes Morpho butterfly wing dimensionality for bio-inspired inorganic 3D structures will be detailed. Functionality and performance parameters of metal-metal oxide thin film coatings on 3D structures will be compared with 2D thin films within the framework of sensor design.

Bio: Michael A. Carpenter received his B.S. in chemistry from SUNY Geneseo in 1991, and a Ph.D. in physical chemistry from the University of Rochester, NY in 1996. He was a postdoctoral associate at Cornell University from 1996 to 1998, and was a postdoctoral associate at Pacific Northwest National Laboratory from 1998 to 2000. He is currently the Interim Dean of the College of Engineering, SUNY Polytechnic Institute. Carpenter has led the development of plasmonics for use as integratable harsh environment chemical sensors as well as the development of high temperature compatible multivariable sensing methods. 

Image: Diana-Andra Borca-Tascius
Diana-Andra Borca-Tascius
Speaker: Diana-Andra Borca-Tasciuc

 Associate Professor, Rensselaer Polytechnic Institute

Bio: Diana-Andra Borca-Tasciuc is an associate professor in the Department of Mechanical Engineering at Rensselaer Polytechnic Institute, which she joined in 2006. She received her B.S. in Physics from Bucharest University in 1996, and M.S. and PhD. in Mechanical Engineering from University of California at Los Angeles in 2001 and respectively 2005. She is a 2008 NSF Career awardee and a 2013 Fulbright scholar. Her research interests are in the area of energy conversion and current projects include power harvesting MEMS, solar power harvesting building envelope and thermal processes at nanoscale. She has co-authored over 100 journal articles and conference proceedings and is a co-inventor on two pending patent applications.

Thermal Challenges

Image: Leila Choobineh
Leila Choobineh
Session Chair: Leila Choobineh

Assistant Professor, SUNY Polytechnic Institute

Image: Peter DeBock
Peter DeBock
Session Chair: Peter deBock 

Principal Thermal Engineer, GE Research

Image: Gamal Refai Ahmed
Gamal Refai Ahmed
Speaker: Gamal Rafei-Ahmed

Distinguished Engineer, Xilinx Inc.

Best Engineering Practices to Establish Cooling Limit for 375W Add-in PCI-e Center Accelerator Card with Active Optical

Bio: Dr. Gamal Refai-Ahmed,  Life Fellow ASME, Fellow Canadian Academy of Engineering, P.Eng. (ON, Canada) is a Chief Engineer &Senior Technical Director and Adjunct Professor in Watson School of Engineering and Applied Science SUNY Binghamton and Department of Mechanical Engineering, University of Toronto.   Prior to Xilinx, he was a Senior Engineer with GE Global Research Center, AMD Fellow.  Dr. Refai-Ahmed obtained his B. Sc. and M. Sc. degrees from Alexandria University. He obtained the M. A. SC. and Ph. D. degrees in Mechanical Engineering from the University of Waterloo.

Dr.  Gamal Refai-Ahmed’s work  in  the  field  of  thermal  management of electronics packaging  for  more  than  25 years.  His name has been recognized as one of the global technical leaders of thermal management through his numerous publications (more than 100 publications) and patents& patents pending US (more than 50) and International (more than 100). His contributions are clearly seen in several generations of both GPU and FPGA products. These products have successfully enable Computing and Telecom equipment to achieve new level of performance and life time reliability from thermal management point of view.

  Furthermore, his vision to drive academia and industry to establish an ecosystem of a research business model, as well as, his scholarly achievements has been seen clearly in his activities as adjunct professor at University of Binghamton and University of Toronto, as well as, Industrial forms such as ODCC, SRC, ITRS and HIR. 

Gamal Playing active role as a member of the Executive committee of Heterogonous Integration Road Map, HIR. He actively established the joint sponsor of  ASME and  IEEE packaging society of the HIR.  Currently, he is the Vice chair of the IEEE Packaging Society  Santa Clara Chapter.  Also, he has been serving as associate editors for several transactions and key player to organize tier-1 conferences such as ITHERM, InterPack, IMECE and ECTC.

Gamal is the recipient of 2008 excellent thermal management award, 2010 best Associate Editor J Electronics Packaging, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2016, ASME board of governs awarded Gamal the  ASME Service Award. State University of New York, Binghamton University awarded him the Innovation Partner Award for his industrial role with the Small Scale Systems Integration and Packaging (S³IP) Center, Binghamton University.

Image: Michael Fish
Michael Fish
Speaker: Michael Fish

Thermal Research Scientist, US Army Research Laboratory

Design Challenges and Opportunities in Package-Integrated Transient Thermal Mitigation

 Phase change materials (PCMs) have attracted the attention of researchers for their promise to buffer or mitigate the effects of transient thermal pulses within electronic systems.  One impediment to deploying PCM-enhanced packaging is a lack of package-level design tools that can illustrate the tradeoffs between performance, size/weight, and cost that results from integrating phase-change materials and/or their composites.  This talk exhibits the extensions made to the Army Research Laboratory’s thermal-mechanical co-design tool, ARL ParaPower to enable both phase change transient modeling and integration into system-level design tools.  By providing rapid surveying capability within any particular design space, simulation burden is reduced and the most promising demonstrators are prioritized.

Bio: Michael Fish leads the transient thermal program as part of the Advanced Power Packaging group at the U.S. Army Research Laboratory. He has expertise in embedded thermal management, simulation, and thermal test bed development. His current effort is in the packaging and management of highly transient electronic systems, with particular focus on directed energy weapons and vehicle electrification and power conversion.  He holds a doctorate in Mechanical Engineering from the University of Maryland, College Park where he studied thermal phenomena in heterogeneously integrated electronic systems.  He received his BS and MS from the University of Virginia, studying micro/nanoscale heat transport and thermal metrology.

Image: Alfonso (Al) Ortega
Alfonso (Al) Ortega
Speaker: Alfonso (Al) Ortega

James R. Birle Professor of Energy Technology

Associate Director, The NSF Center for Energy Smart Electronic Systems, Villanova University

Experimental and Computational Studies of Single and Two-Phase Liquid Cooling in Low Profile Cold Plates with Engineered Porosity

A cold plate can be thought of as a heat exchanger in which the core can be generalized as a porous medium composed of a mixture of the metal (fins, pins, metallic foam ligands) and the coolant.  The porous structure is described by the geometry of the pores or channels, the local porosity, the local pore or channel size, and the surface area per unit volume or surface area density. Results are presented from a systematic study of the performance of cold plates in which these parameters are allowed to spatially vary for a specific channel shape. The results are used as a paradigm for developing design rules for more generalized porous structures whose properties can be engineered and optimized for maximum thermal performance

Bio: Dr. Alfonso Ortega is the James R. Birle Professor of Energy Technology at Villanova University. He is the Director of the Laboratory for Advanced Thermal and Fluid Systems and the Founding Director of the Villanova site of the NSF Center for Energy Smart Electronic Systems (ES2).  He is currently Associate Director of the NSF ES2 Center.  He received his B.S. from The University of Texas-El Paso, and his M.S. and Ph.D. from Stanford University, all in Mechanical Engineering. He was on the faculty of the Department of Aerospace and Mechanical Engineering at The University of Arizona in Tucson for 16 years. For two years, he served as the Program Director for Thermal Transport and Thermal Processing in the Chemical and Transport Systems Division of The National Science Foundation.  Dr. Ortega is a Fellow of the ASME and received the 2003 SEMITHERM Thermie Award and the 2017 ITHERM Achievement Award in recognition of his contributions to the field of electronics thermal management. He is an internationally recognized expert and frequent lecturer in the field of electronics thermal management and experimental measurements in the thermal sciences.

Image: Kamal Sikka
Kamal Sikka
Speaker: Kamal Sikka

 Sr. Technical Staff Member, IBM

HI Challenges for High-End Server and Cloud Systems

With transistor scaling saturating, heterogeneous integration packaging has made a comeback with the development of multi-chip organic-laminate packages. Several new packaging constructs such as 2D MCMs, Si bridges, 2.5/3D MCMs, and wafer level integration schemes have been developed in the recent past. This talk will compare and contrast these different packaging schemes, focusing on the associated technical challenges.

Bio: Kamal Sikka is a Senior Technical Staff Member at IBM Research with more than 20 years of work experience. He has participated in developing complex ceramic and organic-laminate packages used in several generations of IBM servers and for several IBM customers such as Microsoft and SONY. His expertise is in package design and modeling, focusing on thermo-mechanical aspects. He currently works on developing new Heterogeneous Integration packaging constructs for high-end AI server and cloud applications. He is the leader of the IBM Research Heterogeneous Integration Packaging Laboratory.

Wearable Electronics for Medical Applications

Image: Azar Alizadeh
Azar Alizadeh
Session Chair: Azar Alizadeh

Principal Scientist, GE Research

Image: Scott Miller
Scott Miller
Session Chair: Scott Miller

Director of Strategic Programs, NextFlex

Image: Ahyeon Koh
Ahyeon Koh
Speaker: Ahyeon Koh

Assistant professor, Department of Biomedical Engineering, SUNY Binghamton University

Advanced Biocompatible Sensing Platforms

Sensors in biomedical applications monitoring critical chemical information (e.g., pH and glucose) and vital physical signs (e.g., temperature and ECG) are utilized with rigid electrodes and thus, limit intimate integration with our bodies that are soft, curved, stretched, and continuously evolving. The mismatch of mechanical properties between sensors and dynamic living biological systems causes tissue damage and/or induce the foreign body response, leading to inaccurate measurements. Additionally, unconformable contact of sensors on the body system impedes their function of the device in a biomedical and wearable health monitoring application. Therefore, my research has been focused on developing biosensors to enable quantitative analytical detection along with enhancing the biocompatibility of mechanical and chemical properties of devices. These advanced sensing systems hold great potential to improve human life and health indeed. Herein, I will present the development of biocompatible biosensors: (1) epidermal microfluidic sensor with wireless communication electronics for sweat monitoring, (2) ultrathin injectable temperature sensors for cardiac ablation monitoring; (3) porous sensors capable of natural convection of biofluids. Each sensing systems was specifically developed to eliminate profound mismatch in mechanical properties or to mimic an active biological system exploiting the role of a living system. These unique approaches in developing biomedical sensors bring significant advances in biomedical and mobile health applications.

Bio: Dr. Ahyeon Koh is an Assistant Professor in the Biomedical Engineering Department at Binghamton University. Her research group is seeking the solution to develop chemically and mechanically biocompatible electrochemical biosensors and intimately bio-integrated sensing system. Her expertise includes electrochemical biosensors, flexible and stretchable sensors, biocompatible sensors and materials, analytical devices for biomedical applications.

Image: christine kallmayer
christine kallmayer
Speaker: Christine Kallymayer

Flexible Electronics and Smart Textiles for Medical Applications

Patient monitoring has been a focus in the development of smart textiles from the beginning. T-Shirts with different sensor functionalities have been developed over the years. Not many products have been brought to market successfully. Recently there is a trend to expand the area of application. E-Textiles but also flexible devices like patches are used in prophylaxis, diagnosis, monitoring, treatment and rehabilitation. These new devices are very specialized and optimized for different locations on the body. This specialization of the devices lead to new requirements regarding the materials and integration technologies – for textiles as well as flexible and stretchable modules.

Bio: Christine Kallmayer received a diploma in experimental physics at the University of Kaiserslautern in 1994. Since 1998 she is responsible for the group „System on Flex“ at Fraunhofer IZM. The main research areas are new technologies for flip chip integration on and in flex by soldering or adhesive bonding. Especially technologies for ultrathin chips are developed and investigated. The group is also developing new flexible substrate materials, e.g. based on thermoplastic polymers, together with optimized assembly technologies. A current research focus is on stretchable and conformable electronics based on textiles as well as elastomers. 

Image: Steve Frierson
Steve Frierson
Speaker: Steve Frierson

Business Development Manager, V Technical Textiles

Conductive Yarns and Fabrics for use as a Sensor Electrodes and Smart Wear Sensors

This presentation will give an overview about the new paradigm of electrodes and sensors for use in wearable devices. Advantages of textile electrodes are their ductility, flexibility, high conductivity and therefore their functionality for sensors and electrodes as well as surveillance of body signals such as EMG and ECG. A vital part of textile electrodes are conductive (silver or other metal compounds) yarns or fabrics integrated directly into the clothing. Through its direct implementation into the clothing (achieved via weaving, knitting, embroidery, etc.), the textile electrode guarantees an ideal body fit as well as enhancing patient compliance because it prevents intolerances of the patients resulting from the awkwardness of conventional electrodes. In addition, textile electrodes are washable, sterilize-able, re-usable, and can be applied to a wide variety of base materials. Applications of textile sensors are for example EMG, ECG, EEG as well as the measurement of skin resistance. Applications of textile actuators are for instance TENS, FES, and EMS.

 Bio: Steve Frierson is the business development manager for V Technical Textiles, Inc. Currently Steve is responsible for managing sales and new product applications at V Technical Textiles; working directly with their numerous customers. As business development manager, Steve’s activities include but are not limited to the following:

·       New business development

·       Sales management

·       Customer care

·       Project review

·       New product design and development

·       Product application

Steve’s background and experience includes RF Shielding, Conductive Textiles, Value added services, electrical engineering, and EMI/EMC and product safety testing.

With over 19 years of experience in the product testing and shielding industries, Steve has worked on large and small projects all over the country. Steve has successfully completed work for NASA, 3M, UTC, Raytheon and several other companies of all industries and size throughout his career in the conductive textile industry. 

Image: sheng xu
sheng xu
Speaker: Sheng Xu

Adding a new sensing dimension to soft electronics: from the skin to below the skin

Soft electronic devices that can acquire vital signs from the human body represent an important trend for healthcare. Combined strategies of materials design and advanced microfabrication allow the integration of a variety of components and devices on a stretchable platform, resulting in functional systems with minimal constraints on the human body. In this presentation, I will demonstrate a wearable multichannel patch that can sense a collection of signals from the human skin in a wireless mode. Additionally, integrating high-performance ultrasonic transducers on the stretchable platform adds a new third dimension to the detection range of conventional soft electronics. Ultrasound waves can penetrate the skin and noninvasively capture dynamic events in deep tissues, such as blood pressure and blood flow waveforms in central arteries and veins. This stretchable platform holds profound implications for a wide range of applications in consumer electronics, sports medicine, defense, and clinical practices.

 Bio: Sheng Xu is currently an assistant professor in the Department of Nanoengineering at UC San Diego. He received his B.S. in Chemistry and Molecular Engineering from Peking University in Beijing, China, and Ph.D. in Materials Science and Engineering from Georgia Institute of Technology. He worked as a postdoctoral research associate in the Department of Materials Science and Engineering at the University of Illinois at Urbana-Champaign. His group focuses on biointegrated electronics for health monitoring and human-machine interfaces. His research has been highlighted as “Groundbreaking Research in 2018” by Forbes, “12 innovations that will revolutionize the future of medicine” by National Geographic, and 2018 NIH-wide end-of-year review. He has been recognized by a number of awards, including the MIT Technology Review 35 Innovators Under 35, NIH NIBIB Trailblazer Award, NHLBI Technology Development Award, Wellcome Trust Innovator Award, 3M Non-Tenured Faculty Award, and MRS Outstanding Young Investigator Award. He serves Nano Research as a Young Star Editor.