Mechanical Engineering Research

Various research from Mechanical Engineering

Areas of Research Conducted by our Faculty

Research Facilities

Current Funded Research 

Design and Manufacturing 

Changhong Ke 

  • NASA NY Space Grant Consortium – Cornell University 
  • Exploiting Nanoscale Interfaces to Enhance Bulk Mechanical Response of Additively Manufactured Boron Nitride Nanotube-Metal Composites – National Science Foundation 

SB Park

  • ACORN (Air-deployable Cost-effective Organic Radiation Nodes) - General Electric Global Research
  • Evaluation of TGV Thermo-Mechanical Behavior by Micro DIC – Corning Incorporated
  • Development of Closed-Loop Control and Optimization Modules of the Printed Circuit Board Assembly Processes in Surface Mount Technology - Koh Young Technology Incorporated
  • Development of Pick and Placement Machine On/Offline Optimization and Diagnosis Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated

Bahgat Sammakia

  • SRC CHIRP: Design, Fabrication, and Testing of Metal Porous Media for Thermal Capacitor and Immersion Cooling Applications -  Purdue University

Bahgat Sammakia (PI), Scott Schiffres, SB Park (co-PI’s)

  • Radiation-Hard Microelectronics Workforce Development Consortium  – Purdue University 

Bahgat Sammakia (PI), Scott Schiffres, SB Park, Srikanth Rangarajan (co-PI’s)

  • Design, Develop and Demonstrate a True 3D Packaging -  SUNY Applied Materials Research Institute

Scott Schiffres 

  • COVID: Mask Filtration and Pressure Drop Testing - Intuitive Foundation
  • I-Corps: Additive Laser Metal Deposition onto Sillicon for Enhanced Electronics Cooling – National Science Foundation
  • CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation

Scott Schiffres (PI), Bahgat Sammakia, Changhong Ke (co-PI’s) 

  • PFI-TTT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices – National Science Foundation 

Scott Sciffres (PI), Bahgat Sammakia, SB Park (Co-PI’s) 

  • CHIRP: Minimizing Thermal Interfacial Resistance in Heterogeneous Integrated Integration (HI): A Benchmarking Study and Production Tool (Proposal Number W32613) – Purdue University 

Pu Zhang

  • Testing Agreement - Micro-CT Characterization of Additive Manufactured Stainless Steel Parts -  Technical Data Analysis Incorporated

ADDITIONAL INFORMATION

Dynamic Systems

Ronald Miles (PI), Changhong Ke (Co-PI)

  • Capacitive Pressure/ Velocity Probe for Acoustic Measurements in the Human Ear Canal - National Inst on Deafness & Other Comm Disorders

Sherry Towfighian (PI) 

  • MEMS High Voltage Triboelectric Levitation: A Generactuator - National Science Foundation

Mark Poliks (PI), Shahrzad Towfighian (Co-PI)

  • Soft Electronic Skin-Innervated Robotic Work for Rapid Maintenance of Strategic Assets (Sensiworm), SEMI-Flex Tech

Additional Information

Materials

Junghyun Cho

  • Electronic Assembly Solder Alloy Development - University Instruments Corp.
  • PDRD Conformal Coating Tin Whiskers - Honeywell Federal Manufacturing & Technologies LLC

Guangwen Zhou

  • Collaborative Research: Coordinated In-Situ Dynamic Experiments and Atomistic Modeling of Surface Segregation in Alloys- National Science Foundation
  • In Situ Visualization and Theoretical Modeling of Early Stages of Oxidation of Metals and Alloys - US Department of Energy.

Additional Information

Solid Mechanics

Changhong Ke

  • Numerical Simulation of Spray Deposited Electrolyte Layer for Proton Conducting Fuel Cells - Board of Regents of the University of Nebraska
  • Exploiting Nanoscale Interfaces to Enhance Bulk Mechanical Response of Additively Manufactured Boron Nitride Nanotube-Metal Composites – National Science Foundation

SB Park

  • ACORN (Air-deployable Cost-effective Organic Radiation Nodes) - General Electric Global Research
  • Evaluation of TGV Thermo-Mechanical Behavior by Micro DIC – Corning Incorporated

Mir Jalil Razavi 

  • Mechanics of the Formation of Cortical Folding Patterns in the Developing Human Brain - National Science Foundation

Pu Zhang

  • Testing Agreement - Micro-CT Characterization of Additive Manufactured Stainless Steel Parts -  Technical Data Analysis Incorporated

ADDITIONAL INFORMATION

Transport Phenomena and Energy 

Paul Chiarot

  • SRC CHIRP: Conformal Polymeric Thin Films Manufactoring Using Electrospray Printing - Purdue University
  • CAREER: Additive Manufacturing using Electrospray Printing of Nanoparticle Inks – National Science Foundation

Bahgat Sammakia

  • SRC CHIRP: Design, Fabrication, and Testing of Metal Porous Media for Thermal Capacitor and Immersion Cooling Applications -  Purdue University
  • CHIRP: Direct Liquid and Two Phase Cooling of High Heat Flux Electronics in Heterogeneous Integrated (HI) Packages: Experimental and Analytical Studies at the Device and Module Levels -  Purdue University

Bahgat Sammakia (PI), Scott Schiffres, SB Park (co-PI’s)

  • Radiation-Hard Microelectronics Workforce Development Consortium Subagreement No. 13000844-021 – Purdue University 

Bahgat Sammakia (PI), Scott Schiffres, SB Park, Srikanth Rangarajan (co-PI’s)

  • Design, Develop and Demonstrate a True 3D Packaging -  SUNY Applied Materials Research Institute

Scott Schiffres 

  • COVID: Mask Filtration and Pressure Drop Testing - Intuitive Foundation
  • I-Corps: Additive Laser Metal Deposition onto Sillicon for Enhanced Electronics Cooling – National Science Foundation
  • CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation

Scott Schiffres (PI), Bahgat Sammakia, Changhong Ke (co-PI’s) 

  • PFI-TTT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices – National Science Foundation 

Scott Sciffres (PI), Bahgat Sammakia, SB Park (Co-PI’s) 

  • CHIRP: Minimizing Thermal Interfacial Resistance in Heterogeneous Integrated Integration (HI): A Benchmarking Study and Production Tool  – Purdue University 

Xin Yong

  • Understanding "wild-type" nanoplastic uptake in single microalgae cells with florescense tracking and computational modeling – National Science Foundation
  • Capillary-Assisted Printing of Structured Colloidal Monolayers - National Science Foundation

Additional Information

Related Research Centers