Areas of Research Conducted by our Faculty
Research Facilities
- Acoustics Core
- Additive Manufacturing Laboratory
- Micro/Nano-Electro-Mechanical Systems
- Opto-Mechanics
- Transport Sciences Core
- Vibration Core
Current Funded Research Projects
Design and Manufacturing
SB Park
- Advanced Modeling and Simulation for Packaging Reliability - Analog Devices, Inc.
- Development of Pick and Placement Machine On/Offline Optimization and Diagnosis Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated
- Thermal Analyses of 2.5D Package Assemblies - Juniper Networks Incorporated
- Process Failure Mode Effect Analysis & Development of Printer Advising/ Online Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated
Scott Schiffres
- CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation
- Next Generation HVAC Adsorption Compressorless HVAC Using Advanced Materials - EthosGen LLC
Dynamic Systems
Ron Miles (PI), Changhong Ke (Co-PI)
- Capacitive Pressure/ Velocity Probe for Acoustic Measurements in the Human Ear Canal - National Inst on Deafness & Other Comm Disorders
Sherry Towfighian (PI), Ron Miles (Co-PI)
- A New Approach to Capacitive Sensing: Repulsive Sensors - National Science Foundation
Sherry Towfighian
- MEMS High Voltage Triboelectric Levitation: A Generactuator-National Science Foundation
- An implantable self-powered load sensor for total knee replacement health monitoring - National Institutes of Health
Energy
Congrui Jin
- Mechanics in Hydrogen Production SOW-15976-Batelle Energy Alliance, LLC
- High Temperature Creep Failure of Additively Manufactured Metals - University of Science and Technology Beijing
Scott Schiffres
- CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation
Sherry Towfighian
- An implantable self-powered load sensor for total knee replacement health monitoring - National Institutes of Health
Materials
Junghyun Cho
- Electronic Assembly Solder Alloy Development - University Instruments Corp.
- PDRD Conformal Coating Tin Whiskers - Honeywell Federal Manufacturing & Technologies LLC
Guangwen Zhou
- Collaborative Research: Coordinated In-Situ Dynamic Experiments and Atomistic Modeling of Surface Segregation in Alloys- National Science Foundation
- Materials Synthesis and Simulations Across Scales (MS3) Richland, WA, USA - Pacific Northwest National Laboratory
- In Situ Visualization and Theoretical Modeling of Early Stages of Oxidation of Metals and Alloys - US Department of Energy.
Stanley Whittingham (PI), Guangwen Zhou (Co-PI)
- Northeast Center for Chemical Energy Storage (NECCES) - US Department of Energy.
Solid Mechanics
Congrui Jin
- Assessment of Electrolyte Diffusion - UT Batelle LLC
- High Temperature Creep Failure of Additively Manufactured Metals - University of Science and Technology Beijing
Changhong Ke
- Collaborative Research: Experimental and Computational Nanomechanics of the Load Transfer Mechanisms at the Graphene Polymer Interface - National Science Foundation
- NASA/New York Space Grant Consortium National Space Grant College and Fellowship Program 2015-2018 - Cornell University
SB Park
- Advanced Modeling and Simulation for Packaging Reliability - Analog Devices, Inc.
- Development of Pick and Placement Machine On/Offline Optimization and Diagnosis Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated
- Process Failure Mode Effect Analysis & Development of Printer Advising/ Online Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated
Transport Phenomena
Paul Chiarot
- CAREER: Additive Manufacturing using Electrospray Printing of Nanoparticle Inks - National Science Foundation
- Electrospray Deposition of PTFE Coatings - Schick Manufacturing Incorporated
- Electrohydrodynamic Atomization of Fuels Using Charge-Injection for Efficient Flameless Catalytic Combustion at Small Scale - American Chemical Society
Paul Chiarot (PI) and Peter Huang (Co-PI)
- Perivascular Transport of Solutes from the Brain - National Institutes of Health
Scott Schiffres
- I-Corps: Additive Laser Metal Deposition onto Silicon for Enhanced Electronics Cooling-National Science Foundation
- CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation
- Next Generation HVAC Adsorption Compressorless HVAC Using Advanced Materials - EthosGen LLC
- CHIRP: Minimizing Thermal Interfacial Resistance in Heterogeneous Integrated Integration (HI): A Benchmarking Study and Production Tool (Proposal Number W32613)-Purdue University
Xin Yong
- Mesoscale Modeling of Stimuli-Responsive Composite Colloids at Oil-Water Interfaces - American Chemical Society
Xin Yong (PI), Paul Chiarot (Co-PI), Tim Singler (Co-PI)
- Inkjet-Electrospray Hybrid Printing: Understanding the Processing-Structure Relationship - National Science Foundation.
Related Research Centers
- The Small Scale Systems Integration and Packaging (S3IP) Center
- Integrated Electronics Engineering Center (IEEC)
- Center for Advanced Microelectronics Manufacturing (CAMM)
- Center for Autonomous Solar Power (CASP)
- Center for Advanced Sensors and Environmental Systems (CASE)
- Institute for Materials Research
- Other Watson Research Centers