Mechanical Engineering Research

Various research from Mechanical Engineering

Areas of Research Conducted by our Faculty

Research Facilities

Current Funded Research Projects

Design and Manufacturing 

SB Park

  • Development of Pick and Placement Machine On/Offline Optimization and Diagnosis Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated
  • Thermal Analyses of 2.5D Package Assemblies - Juniper Networks Incorporated
  • Process Failure Mode Effect Analysis & Development of Printer Advising/ Online Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated

Scott Schiffres 

  • CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation
  • Next Generation HVAC Adsorption Compressorless HVAC Using Advanced Materials - EthosGen LLC

ADDITIONAL INFORMATION

Dynamic Systems

Ron Miles (PI), Changhong Ke (Co-PI)

  • Capacitive Pressure/ Velocity Probe for Acoustic Measurements in the Human Ear Canal - National Inst on Deafness & Other Comm Disorders

Sherry Towfighian (PI), Ron Miles (Co-PI)

  • A New Approach to Capacitive Sensing: Repulsive Sensors - National Science Foundation

Sherry Towfighian 

  • MEMS High Voltage Triboelectric Levitation: A Generactuator-National Science Foundation
  • An implantable self-powered load sensor for total knee replacement health monitoring - National Institutes of Health

Additional Information

Energy

Congrui Jin

  • Mechanics in Hydrogen Production SOW-15976-Batelle Energy Alliance, LLC
  • High Temperature Creep Failure of Additively Manufactured Metals - University of Science and Technology Beijing

Scott Schiffres

  • CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation

Sherry Towfighian

  • An implantable self-powered load sensor for total knee replacement health monitoring - National Institutes of Health

Additional Information

Materials

Junghyun Cho

  • PDRD Conformal Coating Tin Whiskers - Honeywell Federal Manufacturing & Technologies LLC

Guangwen Zhou

  • Collaborative Research: Coordinated In-Situ Dynamic Experiments and Atomistic Modeling of Surface Segregation in Alloys- National Science Foundation
  • Materials Synthesis and Simulations Across Scales (MS3) Richland, WA, USA - Pacific Northwest National Laboratory
  • In Situ Visualization and Theoretical Modeling of Early Stages of Oxidation of Metals and Alloys - US Department of Energy.

Stanley Whittingham (PI), Guangwen Zhou (Co-PI)

  • Northeast Center for Chemical Energy Storage (NECCES) - US Department of Energy. 

Additional Information

Solid Mechanics

Congrui Jin

  • Assessment of Electrolyte Diffusion - UT Batelle LLC
  • High Temperature Creep Failure of Additively Manufactured Metals - University of Science and Technology Beijing

Changhong Ke

  • Collaborative Research: Experimental and Computational Nanomechanics of the Load Transfer Mechanisms at the Graphene Polymer Interface - National Science Foundation
  • NASA/New York Space Grant Consortium National Space Grant College and Fellowship Program 2015-2018 - Cornell University

SB Park

  • Development of Pick and Placement Machine On/Offline Optimization and Diagnosis Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated
  • Process Failure Mode Effect Analysis & Development of Printer Advising/ Online Modules in Printed Circuit Board Assembly Process - Koh Young Technology Incorporated

ADDITIONAL INFORMATION

Transport Phenomena

Paul Chiarot

  • CAREER: Additive Manufacturing using Electrospray Printing of Nanoparticle Inks - National Science Foundation
  • Electrospray Deposition of PTFE Coatings - Schick Manufacturing Incorporated
  • Electrohydrodynamic Atomization of Fuels Using Charge-Injection for Efficient Flameless Catalytic Combustion at Small Scale - American Chemical Society

Paul Chiarot (PI) and Peter Huang (Co-PI)

  • Perivascular Transport of Solutes from the Brain - National Institutes of Health 

Scott Schiffres

  • I-Corps: Additive Laser Metal Deposition onto Sillicon for Enhanced Electronics Cooling-National Science Foundation
  • CAREER: Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation
  • Next Generation HVAC Adsorption Compressorless HVAC Using Advanced Materials - EthosGen LLC
  • CHIRP: Minimizing Thermal Interfacial Resistance in Heterogeneous Integrated Integration (HI): A Benchmarking Study and Production Tool (Proposal Number W32613)-Purdue University

Xin Yong

  • Mesoscale Modeling of Stimuli-Responsive Composite Colloids at Oil-Water Interfaces - American Chemical Society

Xin Yong (PI), Paul Chiarot (Co-PI), Tim Singler (Co-PI)

  • Inkjet-Electrospray Hybrid Printing: Understanding the Processing-Structure Relationship - National Science Foundation.

Additional Information

Related Research Centers