Design and Manufacturing
Computer-aided design, optimal design, design with reliability, additive manufacturing, micro- and nano-fabrication.
Recent Publications
- C. H. Hoang, M. Tradat, Y. Manaserh, B. Ramakrisnan, S. Rangarajan, Y. Hadad, S. N. Schiffres, B. Sammakia, Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product. InterPack2020-2627, 2020.
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M. H. Bagheri, R. T. Loibl, S. N. Schiffres, Control of Water Adsorption via Electrically Doped Graphene. Advanced Materials Interfaces, 2021, 2100445.
- “A Comprehensive Solution for Modeling Moisture Induced Delamination in Electronic Packaging during Solder Reflow,” Jing Wang, Yuling Niu, S. Shao, H. Wang, J. Xu and Seungbae Park, Microelectronics Reliability, vol. 112, 2020 A Comprehensive Solution for Modeling Moisture Induced Delamination in Electronic Packaging during Solder Reflow
