The CAMM also provides additional BU infrastructure in materials analysis, and systems integration. These facilities are maintained by Ph.D. level professional staff, and provide: shared research equipment for all partners; expert training of students, scientists and engineers in experimental techniques; technical expertise necessary to operate sophisticated experimental equipment effectively and consistently; facilitated cooperation between industry and universities; and a meeting ground for researchers from varied disciplines and foster interactions that may develop into new interdisciplinary collaborations.
Electronics packaging facilities at the Integrated Electronics Engineering Center include an on-site demonstration facility that allows for rigorous and replicable testing of new technologies. Laboratories are equipped for analyzing electronics packaging technology products and are useful for performing physical, chemical, surface and electronic analysis of products and materials. Services include: measurement of material properties; design and reliability testing; and product analysis for determining manufacturing viability. Instrumentation includes: Thermal cycling chambers; Temperature and humidity chambers; Thermal shock chamber; HAST chamber; Shock tables; a JEDEC standard; Shaker table with oven; Material testing systems; Digital image correlation system; Shadow / cross sectional moiré; and Nano indentation/AFM.
Analytical and diagnostics infrastructure is available at the Analytical and Diagnostics Laboratory, a $21M, 8,000 sq. ft. multiuser facility that includes FIB, TEM, SEM, AFM, confocal microscopy, X-ray diffractometry, and a microfabrication facility. This facility offers researchers new capabilities for measuring material and electronic properties. The Nanofabrication Laboratory is a multi-user facility that supports nano-scale research by providing state-of-the-art resources.